Huizhou Super Idea Wireless Technology Co., Ltd. 2026 Analysis Report on the Proposal for Issuing A Shares to Specific Objects
Huizhou Super Idea Wireless Technology Co., Ltd. (hereinafter referred to as "Super Idea" or "the Company") is listed on the Growth Enterprise Market of the Shenzhen Stock Exchange. To meet the Company's capital needs for business development, enhance its capital strength, and improve profitability, in accordance with the "Company Law of the People's Republic of China" (hereinafter referred to as the "Company Law"), the "Securities Law of the People's Republic of China" (hereinafter referred to as the "Securities Law"), the "Administrative Measures for the Registration of Issuance of Securities by Listed Companies" (hereinafter referred to as the "Registration Measures"), and the "Articles of Association of Huizhou Super Idea Wireless Technology Co., Ltd." (hereinafter referred to as the "Articles of Association"), and other relevant laws, regulations, and normative documents, the Company proposes to issue A shares to specific objects (hereinafter referred to as "this issuance" or "this issuance to specific objects"). The Company has compiled this analysis report on the proposal for issuing shares to specific objects.
Unless otherwise specified in this report, the terms used herein have the same meaning as in the "Proposal of Huizhou Super Idea Wireless Technology Co., Ltd. for Issuing A Shares to Specific Objects in 2026".
I. Background and Objectives of This Issuance to Specific Objects
(I) Background of This Issuance to Specific Objects
- Policy continues to support the development of new-generation information technology, artificial intelligence, and satellite internet industries.
In recent years, the state has continuously promoted the construction of new-generation information infrastructure and the high-quality development of the electronic information manufacturing industry, supporting technological innovation and industrialization in strategic emerging industries and future industries such as artificial intelligence, advanced computing, smart wearable devices, and satellite internet. Relevant industrial policies encourage the development of new electronic components, key terminal equipment, and efficient thermal management technologies, providing a favorable policy environment for AI server cooling modules, lightweight RF components for smart glasses, and low-orbit satellite communication antennas and modules.
- Expansion of AI computing power infrastructure drives demand for efficient liquid cooling and heat dissipation.
With the expansion of artificial intelligence training and inference scale, the power consumption and heat flux density of AI chips, high-speed optical modules, and server cabinets are continuously increasing. End customers' requirements for heat dissipation efficiency, airtightness, reliability, and batch consistency are constantly rising. Traditional air cooling can no longer meet the energy efficiency and heat dissipation requirements in high-power density scenarios, and liquid cooling technology is gradually becoming the mainstream heat dissipation solution. Currently, leading domestic and international companies are adopting liquid cooling as their core heat dissipation solution, further driving the demand for liquid cooling and accelerating industry development.
- Smart glasses are entering a period of accelerated industrialization, with increasing demand for lightweight and integrated solutions.
Smart glasses are in a phase of rapid product iteration and accelerated supply chain consolidation. Their miniaturized characteristics require antennas, batteries, flexible printed circuit boards, chips, and structural components to be integrated within a limited space, imposing high demands on RF performance, structural strength, overall weight, appearance, and assembly precision. As terminal brand manufacturers continuously iterate their products, upstream supply chains bring good development opportunities, providing excellent market opportunities for companies capable of collaborative R&D with customers and possessing lightweight and integrated capabilities.