300223SZSE
🚨 Material Event

Announcement on the Issuance of H Share Prospectus, H Share Offering Price Cap, and H Share Hong Kong Public Offering

Ingenic Semiconductor Co., Ltd.··3 pages

✨ AI Summary

Beijing君正集成电路股份有限公司 is proceeding with its H share offering on the Hong Kong Stock Exchange. The company has submitted its application and is now publishing its prospectus and details of the offering, including the price cap and public offering arrangements. The shares are expected to list on August 25, 2026.

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Full Translation

AI Translation· gemini_document

Securities Code: 300223

Securities Abbreviation: Junzheng Shares

Announcement No.: 2026-059

Beijing Junzheng Integrated Circuit Co., Ltd.

Announcement on the Issuance of H Share Prospectus, H Share Offering Price Cap, and H Share Hong Kong Public Offering

The Company and all members of the Board of Directors guarantee the truthfulness, accuracy, and completeness of the information disclosed herein, and there are no false records, misleading statements, or material omissions.

Beijing Junzheng Integrated Circuit Co., Ltd. (hereinafter referred to as the "Company") is in the process of applying to issue overseas listed foreign shares (H shares) and list on the Main Board of The Stock Exchange of Hong Kong Limited (hereinafter referred to as the "Hong Kong Stock Exchange") (hereinafter referred to as the "Current Offering and Listing").

On September 15, 2025, the Company submitted its application for the Current Offering and Listing to the Hong Kong Stock Exchange and published the application materials for the Current Offering and Listing on the website of the Hong Kong Stock Exchange on the same day. In accordance with the timetable for the Current Offering and Listing and the relevant regulations of the Hong Kong Stock Exchange, the Company re-submitted its application for the Current Offering and Listing to the Hong Kong Stock Exchange on May 26, 2026, and published the application materials on the website of the Hong Kong Stock Exchange on the same day. For specific details, please refer to the "Announcement on Submitting Application for Issuance and Listing of Overseas Listed Shares (H Shares) to the Hong Kong Stock Exchange and Publishing Application Materials" (Announcement No.: 2025-058) and the "Announcement on Re-submitting Application for Issuance and Listing of Overseas Listed Shares (H Shares) to the Hong Kong Stock Exchange and Publishing Application Materials" (Announcement No.: 2026-040) disclosed by the Company on the Juchao Information Network (www.cninfo.com.cn) on September 15, 2025, and May 26, 2026, respectively.

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