002156SZSE

Guotai Junan Securities Co., Ltd. on the Issuance Sponsorship Letter for TongFu Microelectronics Co., Ltd. A-shares in 2026

TongFu Microelectronics Co., Ltd.··30 pages

✨ AI Summary

Guotai Junan Securities Co., Ltd. has been appointed as the sponsor for TongFu Microelectronics Co., Ltd.'s issuance of A-shares to specific investors in 2026. The total amount to be raised is not to exceed 422 million yuan. The issuance aims to enhance the company's capital structure and support its growth in the semiconductor industry.

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Full Translation

AI Translation· azure_openai

Basic Information on the Securities Issuance

Guotai Junan Securities Co., Ltd. (hereinafter referred to as "the Sponsor" or "Guotai Junan") has accepted the commission from TongFu Microelectronics Co., Ltd. (hereinafter referred to as "the Issuer," "the Company," or "TongFu Microelectronics") to act as its sponsor for the issuance of A-shares to specific investors in 2026 (hereinafter referred to as "this Project"). The Sponsor has appointed Ye Jingxuan and Zhang Chenyu as the designated representatives responsible for recommending this Project.

According to the relevant regulations including the Company Law of the People's Republic of China, the Securities Law of the People's Republic of China, the Administrative Measures for the Registration of Securities Issuance by Listed Companies, the Management Measures for Securities Issuance and Listing Sponsorship Business, and the Shenzhen Stock Exchange Listing Rules, the Sponsor and the designated representatives have issued this sponsorship letter in good faith, diligently, and in accordance with the established business rules and industry self-regulatory norms, ensuring the authenticity, accuracy, and completeness of this sponsorship letter. Unless otherwise specified, the terms used herein have the same meanings as those in the prospectus for the issuance of A-shares to specific investors by TongFu Microelectronics Co., Ltd. in 2026.

Basic Situation of This Securities Issuance

Basic Information of the Sponsoring Representatives

The Sponsor has designated Ye Jingxuan and Zhang Chenyu as the sponsoring representatives for TongFu Microelectronics' issuance of A-shares to specific investors in 2026.

Ye Jingxuan: Sponsoring representative for this project, Master’s degree from the University of Southern California. He has led or participated in projects including the IPO of Zhengfan Technology on the Sci-Tech Innovation Board, the IPO of Huahong Semiconductor on the Sci-Tech Innovation Board, the IPO of Fengli Intelligent on the Growth Enterprise Market, the IPO of Jinshiyuan Liquor on the Main Board, the IPO of Zhongman Petroleum on the Main Board, the IPO of Jieli Technology on the Beijing Stock Exchange, the listing of Fuda Semiconductor on the New Third Board (Direct Link), the private placement of Zhengfan Technology, and the major asset restructuring of I Love My Home, among others. Ye has maintained a good professional record in the sponsorship business.

Zhang Chenyu: Sponsoring representative for this project, Master’s degree from East China Normal University. He has led or participated in projects including the IPO of Zhongman Petroleum on the Main Board, the IPO of Zhengfan Technology on the Sci-Tech Innovation Board, the IPO of Fengli Intelligent on the Growth Enterprise Market, the IPO of Jieli Technology on the Beijing Stock Exchange, the listing of Fuda Semiconductor on the New Third Board (Direct Link), the major asset restructuring of Jinguang Electric, the major asset restructuring of Kangsheng Co., and the private placement of Jinlaite, among others. Zhang has also maintained a good professional record in the sponsorship business.

Project Coordinators and Other Team Members

Other team members include: Wen Hao, Song Kai, Zheng Meiting, Li Hongren, Liu Jingyu, Chen Lin, Feng Feng, Li Fuding.

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