TongFu Microelectronics Co., Ltd.

TongFu Microelectronics Co., Ltd. is a manufacturing company established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Headquartered in Nantong, Jiangsu, the company specializes in integrated circuit packaging and testing. It operates multiple production facilities across China and Malaysia, including locations in Suzhou, Hefei, and Xiamen, and has expanded its capabilities through strategic acquisitions, notably acquiring 85% equity in AMD Suzhou and AMD Penang. The company focuses on technological innovation and has developed a robust quality management system, achieving numerous international certifications. TongFu Microelectronics emphasizes intelligent and digital transformation to enhance productivity and competitiveness. Its main business lines include providing comprehensive packaging and testing solutions, leveraging advanced technology and a professional R&D team. With a strong customer base and industry-leading technology, the company aims to solidify its position as a world-class player in the integrated circuit packaging and testing sector.

1. Rich experience in domestic and international market development and high-quality customer base 2. Industry leading packaging technology level and extensive product layout advantages 3. Scale advantages brought by multi regional layout and cross-border mergers and acquisitions 4. Improved quality management system and advanced intelligent management advantages