Guotai Junan Securities Co., Ltd. on the Issuance Sponsorship Letter for TongFu Microelectronics Co., Ltd. A-shares in 2026
Shenzhen Stock Exchange:
Guotai Junan Securities Co., Ltd. (hereinafter referred to as "the Sponsor" or "Guotai Junan") has accepted the commission from TongFu Microelectronics Co., Ltd. (hereinafter referred to as "the Issuer," "the Company," or "TongFu Microelectronics") to act as its sponsor for the issuance of A-shares to specific investors in 2026 (hereinafter referred to as "this Project"). The Sponsor has appointed Ye Jingxuan and Zhang Chenyu as the designated representatives responsible for recommending this Project.
According to the "Company Law of the People's Republic of China" (hereinafter referred to as "the Company Law"), "Securities Law of the People's Republic of China" (hereinafter referred to as "the Securities Law"), "Administrative Measures for the Registration of Securities Issuance by Listed Companies" (hereinafter referred to as "the Registration Management Measures"), "Management Measures for Securities Issuance and Listing Sponsorship Business" (hereinafter referred to as "the Sponsorship Business Management Measures"), "Guidelines for the Content and Format of Information Disclosure by Companies Issuing Securities No. 27 - Issuance Sponsorship Letters and Issuance Sponsorship Work Reports," "Shenzhen Stock Exchange Stock Listing Rules," and other relevant regulations, the Sponsor and the designated representatives, adhering to the professional spirit of honesty, diligence, and responsibility, have strictly issued this issuance sponsorship letter in accordance with the legally established business rules and industry self-regulatory norms, ensuring the authenticity, accuracy, and completeness of this issuance sponsorship letter. Unless otherwise specified, the relevant terms in this letter have the same meanings as those in the "Prospectus for the Issuance of A-shares to Specific Investors by TongFu Microelectronics Co., Ltd. in 2026."
Section 1 Basic Information on This Securities Issuance
1. Basic Information of the Sponsoring Representatives for This Securities Issuance
The Sponsor has designated Ye Jingxuan and Zhang Chenyu as the sponsoring representatives for TongFu Microelectronics' issuance of A-shares to specific investors in 2026.
Mr. Ye Jingxuan: Sponsoring representative for this project, Master’s degree from the University of Southern California. He has led or participated in projects including the IPO of Zhengfan Technology on the Sci-Tech Innovation Board, the IPO of Huahong Semiconductor on the Sci-Tech Innovation Board, the IPO of Fengli Intelligent on the Growth Enterprise Market, the IPO of Jinshiyuan Liquor on the Main Board, the IPO of Zhongman Petroleum on the Main Board, the IPO of Jieli Technology on the Beijing Stock Exchange, the listing of Fuda Semiconductor on the New Third Board (Direct Link), the private placement of Zhengfan Technology, and the major asset restructuring of I Love My Family. Mr. Ye has strictly adhered to the "Sponsorship Business Management Measures" and other relevant regulations during his practice, maintaining a good professional record.
Mr. Zhang Chenyu: Sponsoring representative for this project, Master’s degree from East China Normal University. He has led or participated in projects including the IPO of Zhongman Petroleum on the Main Board, the IPO of Zhengfan Technology on the Sci-Tech Innovation Board, the IPO of Fengli Intelligent on the Growth Enterprise Market, the IPO of Jieli Technology on the Beijing Stock Exchange, the listing of Fuda Semiconductor on the New Third Board (Direct Link), the major asset restructuring of Jinguang Electric, the major asset restructuring of Kangsheng Co., and the private placement of Jinlaite and Zhengfan Technology, as well as the acquisition of minority equity in subsidiaries by Zhengfan Technology. Mr. Zhang has also strictly adhered to the "Sponsorship Business Management Measures" and other relevant regulations during his practice, maintaining a good professional record.