002156SZSE
🚨 Material Event

Guotai Junan Securities Co., Ltd. on the Sponsorship Letter for TongFu Microelectronics Co., Ltd.'s 2026 A-Share Issuance to Specific Objects

TongFu Microelectronics Co., Ltd.··35 pages

✨ AI Summary

Guotai Junan Securities Co., Ltd. has issued a sponsorship letter for TongFu Microelectronics Co., Ltd.'s planned issuance of A-shares to specific investors in 2026. The total amount to be raised is capped at 422 million yuan. The funds will be allocated to enhance production capacity in various semiconductor sectors, including automotive applications and high-performance computing. The issuance is subject to approval from the Shenzhen Stock Exchange and the China Securities Regulatory Commission.

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Full Translation

AI Translation· azure_openai

Statement

Guotai Junan Securities Co., Ltd. (hereinafter referred to as "Guotai Junan," "the Sponsor," or "this Sponsor") and its sponsoring representatives Ye Jingxuan and Zhang Chenyu, in accordance with the "Company Law of the People's Republic of China," the "Securities Law of the People's Republic of China," the "Regulations on the Registration of Securities Issuance by Listed Companies," the "Management Measures for Securities Issuance and Listing Sponsorship," and other relevant laws, regulations, and the provisions of the China Securities Regulatory Commission (hereinafter referred to as "CSRC") as well as the business rules of the Shenzhen Stock Exchange (hereinafter referred to as "SZSE"), hereby issue this sponsorship letter with honesty, diligence, and responsibility, ensuring that the letter is true, accurate, and complete. Unless otherwise specified, the abbreviations used in this sponsorship letter are consistent with those in the "Prospectus for the A-Share Issuance to Specific Objects by TongFu Microelectronics Co., Ltd. in 2026."

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