I. Amount, Receipt Time, and Storage of Previously Raised Funds
(1) 2020 Private Placement
In 2020, the private placement was approved by the China Securities Regulatory Commission (CSRC) under document [2020] No. 1488 and agreed upon by the Shenzhen Stock Exchange. The company issued 175,332,356 shares of common stock (A shares) at a price of RMB 18.66 per share, raising a total of RMB 3,271,701,762.96. After deducting underwriting and sponsorship fees (excluding a pre-paid sponsorship fee of RMB 1 million) of RMB 23,893,614.10, the net amount raised was RMB 3,247,808,148.86. This amount was transferred to the company's account at China Construction Bank on October 28, 2020. After further deductions for audit fees, legal fees, statutory disclosure fees, and other issuance costs totaling RMB 2,459,165.57, the net amount from this issuance (hereinafter referred to as "2020 Private Placement") was RMB 3,245,348,983.29. The net amount raised from the 2020 Private Placement has been verified by Grant Thornton and documented in verification report No. 110ZC00405. As of December 31, 2025, the special account opened for the 2020 Private Placement has been fully closed.
(2) 2022 Private Placement
In 2022, the private placement was approved by the CSRC under document [2022] No. 261 and agreed upon by the Shenzhen Stock Exchange. The company issued 184,199,721 shares of common stock (A shares) at a price of RMB 14.62 per share, raising a total of RMB 2,692,999,921.02. After deducting underwriting and sponsorship fees of RMB 13,673,249.53 (including VAT), the net amount raised was RMB 2,679,326,671.49. This amount was transferred to the company's accounts at China Merchants Bank and China Construction Bank on October 21, 2022. The net amount raised from the 2022 Private Placement has been verified by Grant Thornton and documented in verification report No. 110C000593. As of December 31, 2025, the specific storage situation of the funds raised in the 2022 Private Placement is as follows:
| Account Unit | Bank | Account Number | Balance (RMB) |
|---|---|---|---|
| Nantong Tongfu | Industrial and Commercial Bank of China | 1111822229100755187 | 0 |
| Tongfu Microelectronics | China Construction Bank | 32050164273600003056 | Closed |
| Tongfu Microelectronics | China Merchants Bank | 551905209810666 | Closed |
| Tongfu Microelectronics | Bank of China | 548278415101 | 162,637.38 |
| Tongfu Microelectronics | China Construction Bank | 32050164273600003170 | 13,324.38 |
| Tongfu Microelectronics | China Merchants Bank | 512902062410558 | 11,446.61 |
| Tongfu Tongke | China Construction Bank | 32050164273600003169 | 2,936,968.81 |
| Tongfu Tongke | China Merchants Bank | 513904958410566 | 46,023.95 |
| Total | 3,170,401.13 |
Note: The above two accounts have been closed due to changes in the use of raised funds.
II. Actual Use of Previously Raised Funds
(1) 2020 Private Placement
- The actual use of funds raised from the 2020 Private Placement is detailed in "Attachment 1-1: Comparison Table of Fund Usage for the 2020 Private Placement."
- Explanation of discrepancies between actual investment amounts and commitments:
| No. | Committed Investment Project | Committed Investment Amount (RMB 10,000) | Actual Investment Amount (RMB 10,000) | Difference Amount (RMB 10,000) | Reason for Difference |
|---|---|---|---|---|---|
| 1 | Construction of Intelligent Packaging Testing Center for Automotive Products | 103,000.00 | 105,450.08 | 2,450.08 | Investment from interest generated in the account |
| 2 | Phase II of Integrated Circuit Packaging Testing Project | 76,020.00 | 76,061.79 | 41.79 | Investment from interest generated in the account |
| 3 | Packaging Testing Project for High-Performance Central Processors and Other Integrated Circuits | 50,000.00 | 50,186.63 | 186.63 | Investment from interest generated in the account |
| 4 | Supplementing Working Capital and Repaying Bank Loans | 95,514.90 | 95,514.90 | 0.00 | Not applicable |
| Total | 324,534.90 | 327,213.40 | 2,678.50 |