Legal Opinion from Beijing Dentons Law Firm on the Company's 2026 Private Placement of A-Shares and Listing
Document Number: Da Cheng Zheng Zi [2026] No. 14
Beijing Dentons Law Firm
16-21F, Tower B, ZT International Center, No.10, Chaoyangmen Nandajie, Chaoyang District, 100020, Beijing, China
Tel: +86 10-58137799
Fax: +86 10-58137788
Table of Contents
- Authorization and Approval for the Private Placement
- Qualification of the Issuer
- Substantive Conditions for the Private Placement
- Establishment of the Issuer
- Independence of the Issuer
- Major Shareholders and Actual Controllers of the Issuer
- Issuer's Capital and Evolution
- Business of the Issuer
- Related Transactions and Industry Competition
- Major Assets of the Issuer and Subsidiaries within the Consolidated Financial Statements
- Major Debts of the Issuer and Subsidiaries within the Consolidated Financial Statements
- Major Asset Changes and Mergers of the Issuer
- Formulation and Amendment of the Issuer's Articles of Association
- Rules of Procedure for Shareholders' Meetings, Board of Directors, and Supervisory Board
- Changes in Directors, Supervisors, and Senior Management of the Issuer
- Taxation of the Issuer and Subsidiaries within the Consolidated Financial Statements
- Environmental Protection, Product Quality, and Technical Supervision
- Labor and Social Security of the Issuer
- Use of Raised Funds by the Issuer
- Business Development Goals of the Issuer
- Impact of the Private Placement on the Issuer's Corporate Governance Structure
- Litigation, Arbitration, or Administrative Penalties
- Other Matters to be Disclosed as Advised by Lawyers
- Review of Application Documents and Information Disclosure for the Private Placement
- Major Intermediaries Related to the Private Placement
- Overall Conclusion
Definitions
In this legal opinion, unless otherwise specified, the following terms have the meanings set forth below:
- "Our Firm" refers to Beijing Dentons Law Firm.
- "Our Lawyers" refers to the lawyers assigned by our firm for this project.
- "Issuer/Company" refers to Tongfu Microelectronics Co., Ltd.
- "This Issuance/Private Placement" refers to the issuer's private placement of A-shares in 2026.
- "Huada Group" refers to Huada Microelectronics Group Co., Ltd., the largest shareholder of the issuer as of September 30, 2025, holding 19.79% of the issuer's shares.
- "Fujitsu Limited" refers to Fujitsu Microelectronics Limited, the predecessor of the issuer.
- "Nantong Wanjie" refers to Nantong Wanjie Computer Systems Co., Ltd.
- "Dongyang Flower" refers to Jiangsu Dongyang Flower Biotechnology Co., Ltd. (formerly Jiangsu Dongyang Flower Cosmetics Co., Ltd.).
- "Jiangsu Hengcheng" refers to Jiangsu Hengcheng Technology Co., Ltd.
- "Fujitsu (China)" refers to Fujitsu (China) Co., Ltd., which was the second-largest shareholder of the issuer and transferred all its shares on May 7, 2018.
- "National Industrial Fund" refers to the National Integrated Circuit Industry Investment Fund Co., Ltd., which was the second-largest shareholder of the issuer as of September 30, 2025, holding 6.67% of the issuer's shares.
- "Hong Kong Central Clearing" refers to Hong Kong Central Clearing Limited, the third-largest shareholder of the issuer, holding 3.54% of the issuer's shares as of September 30, 2025.
- "Zhongshan Jianghai Industrial Fund" refers to Nantong Zhongshan Jianghai Industrial Development Fund Partnership (Limited Partnership), which was the fourth-largest shareholder of the issuer and has transferred its shares as of September 30, 2025.
- "Nantong Jinrun" refers to Nantong Jinrun Microelectronics Co., Ltd., which was the issuer's wholly-owned subsidiary as of September 30, 2025.