002156SZSE

Guotai Junan Securities Co., Ltd. on the Issuance Sponsorship Letter for TongFu Microelectronics Co., Ltd. A-shares in 2026

✨ AI Summary

Guotai Junan Securities has been appointed as the sponsor for TongFu Microelectronics' A-share issuance to specific investors in 2026. The issuance aims to raise funds for expanding production capacity in semiconductor packaging and testing. The internal review committee has approved the project, confirming compliance with relevant laws and regulations. The issuance is expected to enhance the company's market position and financial stability.

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Full Translation

AI Translation· azure_openai

Basic Information on the Securities Issuance

Guotai Junan Securities Co., Ltd. (hereinafter referred to as "the Sponsor" or "Guotai Junan") has accepted the commission from TongFu Microelectronics Co., Ltd. (hereinafter referred to as "the Issuer," "the Company," or "TongFu Micro") to act as the sponsor for its issuance of A-shares to specific investors in 2026 (hereinafter referred to as "this Project"). The Sponsor has appointed Ye Jingxuan and Zhang Chenyu as the designated representatives responsible for recommending this project.

According to the Company Law of the People's Republic of China (hereinafter referred to as "the Company Law"), the Securities Law of the People's Republic of China (hereinafter referred to as "the Securities Law"), the Administrative Measures for the Registration of Securities Issuance by Listed Companies (hereinafter referred to as "the Registration Management Measures"), the Management Measures for Securities Issuance and Listing Sponsorship Business (hereinafter referred to as "the Sponsorship Business Management Measures"), the Guidelines for the Content and Format of Information Disclosure by Companies Issuing Securities No. 27 - Issuance Sponsorship Letters and Issuance Sponsorship Work Reports, the Shenzhen Stock Exchange Stock Listing Rules, and other relevant regulations, the Sponsor and the designated representatives have issued this issuance sponsorship letter in accordance with the principles of honesty, diligence, and responsibility, ensuring the authenticity, accuracy, and completeness of the information provided.

If not otherwise specified, the terms used in this issuance sponsorship letter have the same meanings as those in the prospectus for the issuance of A-shares to specific investors by TongFu Microelectronics Co., Ltd. in 2026.

Basic Situation of This Securities Issuance

Basic Information of the Sponsoring Representatives

The Sponsor has designated Ye Jingxuan and Zhang Chenyu as the sponsoring representatives for TongFu Micro's issuance of A-shares to specific investors in 2026.

Ye Jingxuan: The sponsoring representative for this project, holds a master's degree from the University of Southern California. He has led or participated in projects including the IPO of Zhengfan Technology on the Sci-Tech Innovation Board, the IPO of Huahong Semiconductor on the Sci-Tech Innovation Board, the IPO of Fengli Intelligent on the Growth Enterprise Market, the IPO of Jinshiyuan Liquor on the Main Board, the IPO of Zhongman Petroleum on the Main Board, the IPO of Jieli Technology on the Beijing Stock Exchange, the listing of Fuda Semiconductor on the New Third Board (Direct Link), and the non-public issuance of shares by Zhengfan Technology, among others. Ye Jingxuan has maintained a good professional record in the sponsorship business.

Zhang Chenyu: The sponsoring representative for this project, holds a master's degree from East China Normal University. He has led or participated in projects including the IPO of Zhongman Petroleum on the Main Board, the IPO of Zhengfan Technology on the Sci-Tech Innovation Board, the IPO of Fengli Intelligent on the Growth Enterprise Market, the IPO of Jieli Technology on the Beijing Stock Exchange, the listing of Fuda Semiconductor on the New Third Board (Direct Link), the major asset restructuring of Jinguang Electric, the major asset restructuring of Kangsheng Co., and the non-public issuance of shares by Zhengfan Technology, among others. Zhang Chenyu has maintained a good professional record in the sponsorship business.

Project Coordinators and Other Team Members

Dong Junhao: Project coordinator, holds a master's degree from St. Joseph's University in the United States. He has led or participated in projects including the IPO of Zhengfan Technology on the Sci-Tech Innovation Board, the IPO of Fengli Intelligent on the Growth Enterprise Market, the IPO of Jieli Technology on the Beijing Stock Exchange, the listing of Fuda Semiconductor on the New Third Board (Direct Link), the major asset restructuring of I Love My Home, and the non-public issuance of shares by Jinguang Electric, among others. Dong Junhao has maintained a good professional record in the sponsorship business.

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