TCL Industries Holdings Co., Ltd.
Address: TCL Technology Building, Huifeng 3rd Road, Zhongkai High-tech Zone, Huizhou City, Guangdong Province
TCL Industries Holdings Co., Ltd. Announcement on the Public Offering of Technology Innovation Corporate Bonds (Digital Economy) (Phase II) to Professional Investors in 2026
Announcement
Lead Underwriter, Bookrunner, and Bond Trustee
CITIC SECURITIES
CITIC Securities Company Limited
(Address: North Block, Excellence Times Square (Phase II), 8 Huizhong Road, Futian District, Shenzhen City, Guangdong Province)
Joint Lead Underwriters
CICC
China International Capital Corporation Limited
(Address: Floors 27 and 28, Tower 2, China World Trade Center, 1 Jianguomenwai Avenue, Chaoyang District, Beijing)
GUOTAI HAITONG SECURITIES
GUOTAI HAITONG SECURITIES CO., LTD.
(Address: No. 618, Shangcheng Road, China (Shanghai) Pilot Free Trade Zone)
SHENWAN HONGYUAN SECURITIES
SHENWAN HONGYUAN SECURITIES CO., LTD.
(Address: Floor 45, Century Commercial Plaza, No. 989 Leshan Road, Xuhui District, Shanghai)
Date of Signing: August 17, 2026
The Company and all its directors, supervisors, senior management, or persons performing equivalent duties guarantee that the information disclosed in the announcement is true, accurate, and complete.
Important Notes
- TCL Industries Holdings Co., Ltd. (hereinafter referred to as the "Issuer" or the "Company") obtained approval from the China Securities Regulatory Commission (Document No. SFC Permit (2025) 2369) on October 24, 2025, to issue corporate bonds with a face value not exceeding RMB 10 billion to professional investors.
The Issuer is issuing the bonds in tranches. This issuance is the third tranche under the approval for the bonds, with an issuance size not exceeding RMB 2 billion (including RMB 2 billion).
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Tranche 1 has a term of 3 years, with the bond name "26TCLK2" and bond code 524967.SZ. Tranche 2 has a term of 5 years, with the bond name "26TCLK3" and bond code 524968.SZ. The total issuance size for this tranche is no more than RMB 2 billion (including RMB 2 billion). The face value per bond is RMB 100, and the number of bonds issued is no more than 20 million, with an issuance price of RMB 100 per bond.
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In accordance with the "Securities Law" and other relevant regulations, these bonds are exclusively offered to institutional investors among professional investors. Retail investors and individual investors among professional investors are not permitted to participate in the subscription. After these bonds are listed, they will be subject to investor suitability management. Only institutional investors among professional investors will participate in trading. Any trading activities by retail investors and individual investors among professional investors for subscription or purchase will be invalid.
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According to the comprehensive rating by China Chengxin International Credit Rating Co., Ltd., the Company's主体 (entity) credit rating is AAA, with a stable outlook. These bonds have no rating. As of the most recent period before the issuance and listing of these bonds, the Issuer's net assets were RMB 133.343 billion (total owners' equity in the consolidated financial statements as of December 31, 2025). The asset-liability ratio on a consolidated basis was 64.23%, and the asset-liability ratio on a parent company basis was 48.34%. The average annual distributable profit realized by the Issuer in the last three fiscal years was RMB 2.765 billion (the average of net profit attributable to the parent company in 2023, 2024, and 2025, which were RMB 2.215 billion, RMB 1.564 billion, and RMB 4.517 billion, respectively). It is expected to be no less than 1 time the annual interest of these bonds. The Issuer's financial indicators before issuance meet the relevant requirements.