Huatai United Securities Co., Ltd.
Regarding the Listing Sponsorship Report for Chengdu Super Pure Applied Materials Co., Ltd.'s Initial Public Offering of Shares on the ChiNext Market
To the Shenzhen Stock Exchange:
As the sponsor for the initial public offering of shares by Chengdu Super Pure Applied Materials Co., Ltd. (hereinafter referred to as the "Issuer" or the "Company") on the ChiNext market, Huatai United Securities Co., Ltd. and its sponsored representatives have, in accordance with the "Company Law of the People's Republic of China" (hereinafter referred to as the "Company Law"), the "Securities Law of the People's Republic of China" (hereinafter referred to as the "Securities Law"), and other relevant laws and regulations, as well as the relevant regulations of the China Securities Regulatory Commission (hereinafter referred to as the "CSRC") and your exchange, honestly and diligently issued this listing sponsorship report, guaranteeing that the information provided is true, accurate, and complete.
(All abbreviations and definitions in this listing sponsorship report are consistent with the "Prospectus for the Initial Public Offering of Shares by Chengdu Super Pure Applied Materials Co., Ltd. on the ChiNext Market" unless otherwise specified.)
The relevant situation is hereby reported as follows:
I. Basic Information of the Issuer
(I) Overview of the Issuer
Issuer Name: Chengdu Super Pure Applied Materials Co., Ltd.
Registered Address: No. 1166, Xihanggang Airport Second Road, Shuangliu District, Chengdu City
Date of Registration: August 25, 2005
Contact Information: 028-85882022
(II) Main Business, Core Technology, and R&D Level of the Issuer
- Main Business of the Issuer
The Company is a national-level specialized, refined, and innovative "little giant" enterprise focusing on special coating processes and related technologies and materials. It primarily serves industries such as chip manufacturing and precision optics, providing materials modified and precisely processed, cleaned, and coated using special coating processes like vapor deposition, aerosol, and plasma spraying for precision components.
Special coating refers to the process of forming a high-density, low-porosity coating on the surface of equipment components using special coating processes such as vapor deposition, aerosol, and plasma spraying. This coating can alter the physical and chemical properties of the components and stabilize operating conditions, extending their service life. With the iteration of advanced manufacturing processes, particle contamination and trace element contamination have become increasingly significant factors affecting chip yield, showing an "exponential growth" trend. Special coating components are integrated throughout the semiconductor manufacturing industry chain, from silicon wafer epitaxy to the front-end and back-end core equipment of chip manufacturing. These components are required to control particle contamination and trace element contamination to extremely low levels, thereby improving chip yield. The Company has the capability to provide components for various semiconductor equipment such as etching, lithography, metrology, annealing, thin-film deposition, and silicon wafer epitaxy. It is one of the few domestic suppliers of core components for semiconductor etching equipment used in 5nm and below processes.