Special Explanation Regarding Financial Issues in Response to the Inquiry Letter from the Shenzhen Stock Exchange
1. Background
According to the inquiry letter issued by the Shenzhen Stock Exchange on March 9, 2026, regarding Shenzhen Qiangda Circuit Co., Ltd.'s application to issue convertible bonds to unspecified objects, we, as the reporting accountants for the issuance, have conducted a thorough analysis of the financial issues raised in the inquiry letter and supplemented our verification procedures. Below are our responses to the financial issues raised in the inquiry letter.
2. Fundraising and Project Overview
The total amount to be raised from the issuance of convertible bonds is not expected to exceed RMB 550 million (including the principal). After deducting issuance costs, the funds will be invested in the Nantong Qiangda Circuit Technology Co., Ltd. project, which aims to produce 960,000 square meters of multilayer boards and HDI boards annually (hereinafter referred to as the fundraising project). The total investment for the project is RMB 1 billion, with RMB 363.20 million expected to be allocated from the initial public offering (IPO) funds. This fundraising project is part of the initial public offering's fundraising investment projects and has already commenced construction. Due to a significant funding gap between the actual net amount raised during the IPO and the total investment required for the project, we plan to supplement this gap through the issuance of convertible bonds.
3. Financial Data
The project is expected to enhance the production capacity of HDI and high multilayer boards to meet the market's demand for high-layer, high-density, and high-performance products. Upon reaching full production capacity, it is projected to achieve an annual revenue of approximately RMB 163.62 million, with an expected average gross profit margin of 29.58%. The project is planned to complete infrastructure construction and decoration by June of the third year (T+3), with equipment procurement and personnel recruitment starting in the second half of the second year (T+2) and phased production until the sixth year (T+6) when the overall construction of the project is completed.
| Project Name | Total Investment Amount (RMB 10,000) | Amount to be Invested from IPO Funds (RMB 10,000) | Amount Raised from Previous Fundraising (RMB 10,000) |
|---|---|---|---|
| Nantong Qiangda Circuit Technology Co., Ltd. Project | 100,000 | 36,320.41 | 34,927.24 |
4. Previous Fundraising Project Progress
As of March 31, 2026, the cumulative amount used from the previous fundraising project is RMB 43,927.24 million, with a remaining balance of RMB 1,753.17 million. The previous fundraising project has progressed smoothly, with the main construction completed and the project passing the completion acceptance report in November 2025.
5. Adjustments to Previous Fundraising Project
The internal investment structure of the previous fundraising project has been adjusted to better align with market demands and technological advancements. The adjustments do not change the total investment amount and have been approved by the board of directors and supervisory board.
6. Conclusion
The issuance of convertible bonds is necessary to address the funding gap for the ongoing project, which aligns with national industrial policies and market trends. The project is expected to significantly enhance the company's production capacity and competitiveness in the PCB industry.