Important Notice
This annual report summary is derived from the full annual report. To fully understand the company's operating results, financial status, and future development plans, investors should carefully read the full annual report published in designated media by the China Securities Regulatory Commission. All directors attended the board meeting to review this report. The audit opinion from Lixin Certified Public Accountants (Special General Partnership) on this year's financial report is a standard unqualified opinion. Non-standard audit opinion notice: □ Applicable ☑ Not applicable. The company was not profitable at the time of listing and has not achieved profitability currently: □ Applicable ☑ Not applicable.
The profit distribution plan or capital reserve increase plan reviewed by the board during the reporting period is: Based on the total share capital after excluding the shares repurchased in the special securities account as of the equity registration date determined in the 2025 annual equity distribution announcement, a cash dividend of 2.8 yuan (tax included) will be distributed for every 10 shares to all shareholders, with no bonus shares (tax included), and a capital reserve increase of 4.5 shares for every 10 shares to all shareholders.
Company Overview
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Company Profile
- Stock Abbreviation: Liandong Technology
- Stock Code: 301369
- Stock Exchange: Shenzhen Stock Exchange
- Contact Person: Qiu Shaomei
- Office Address: No. 16, Guangming Avenue, Nanhai National High-tech Zone, Foshan City
- Fax: 0757-81802530
- Phone: 0757-83281982
- Email: ir@powertechsemi.com
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Main Business or Product Introduction The company focuses on the research, development, production, and sales of specialized equipment for the back-end packaging and testing in the semiconductor industry. Major products include semiconductor automated testing systems, laser marking equipment, and other electromechanical integration equipment. The automated testing systems are primarily used for testing the functionality and performance parameters of wafers and chips, including power semiconductor testing and mixed-signal integrated circuit testing. The laser marking equipment is mainly used for marking semiconductor chips. The company adheres to an innovation-driven development strategy and, as a leading domestic supplier of semiconductor testing systems, continuously increases investment in equipment R&D and capacity building, focusing on higher power devices, third-generation semiconductor testing capabilities, and integrated circuit testing technology development to provide customers with cost-effective testing solutions.