Securities Code: 301235
Convertible Bond Code: 123251
Securities Abbreviation: Huakang Medical
Convertible Bond Abbreviation: Huayi Convertible Bond
Announcement Number: 2026-068
Wuhan Huakang Century Jingjing Technology Co., Ltd.
Announcement on Receiving Notice of Winning Bid
The Company and all members of the Board of Directors guarantee that the information disclosed is true, accurate, and complete, and that there are no false records, misleading statements, or major omissions.
Wuhan Huakang Century Jingjing Technology Co., Ltd. (hereinafter referred to as the "Company") disclosed the "Notice of Winning Bid for Project" (Announcement Number: 2026-061) on the GEM Information Disclosure Website (www.cninfo.com.cn) on July 8, 2026. Recently, the Company received the "Notice of Winning Bid" issued by the bidding agent, Hubei Provincial Complete Set Bidding Co., Ltd., confirming that the consortium formed by the Company, China Construction Third Engineering Bureau Group Co., Ltd., China Construction Third Engineering Bureau General Contracting Co., Ltd., and China Electronics Industry Information Industry Institute Science and Technology Engineering Co., Ltd. is the winning bidder for the "Phase II EPC General Contracting of Jiufengshan Semiconductor Manufacturing Base Project." The main contents of the winning bid project are announced as follows:
I. Basic Information of the Winning Bid Project
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Construction Scale: The project covers a planned land area of approximately 214 mu, with a total construction area of 390,000 square meters. The total investment is approximately RMB 5.2 billion. The planned construction includes 5 production plants, 1 power station, 1 substation, 4 warehouses, a bulk gas station, and supporting R&D office buildings and shift dormitories. It is used for the R&D and production of semiconductor epitaxial wafers/substrates.
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Construction Location: South of Keji 1st Road and East of Suhu Road, Wuhan East Lake High-tech Development Zone.
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Bidding Scope: EPC general contracting for the Jiufengshan Semiconductor Manufacturing Base Project, as detailed in the pre-qualification documents.
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Winning Bidders: China Construction Third Engineering Bureau Group Co., Ltd., China Construction Third Engineering Bureau General Contracting Co., Ltd., China Electro