Response of Dike Shares and the Sponsor to the Audit Inquiry Letter Regarding the Application for Issuance of Shares to Specific Targets

Stock Code: 300842 Stock Abbreviation: Dike Shares Listing Venue: Shenzhen Stock Exchange

Response Report Regarding the Audit Inquiry Letter on the Application of Wuxi Dike Electronic Materials Co., Ltd. for Issuance of Shares to Specific Targets

Sponsor (Lead Underwriter)

August 2026

Shenzhen Stock Exchange:

We have received the "Audit Inquiry Letter on the Application of Wuxi Dike Electronic Materials Co., Ltd. for Issuance of Shares to Specific Targets" (Audit Letter [2026] No. 020067) (hereinafter referred to as the "Inquiry Letter") issued by your exchange on July 29, 2026. Wuxi Dike Electronic Materials Co., Ltd. (hereinafter referred to as "Dike Shares," the "Company," or the "Issuer"), together with Industrial Securities Co., Ltd. (hereinafter referred to as the "Sponsor"), Shanghai Tongli Law Firm (hereinafter referred to as "Issuer's Counsel"), and Beijing Xinghua Certified Public Accountants (Special General Partnership) (hereinafter referred to as the "Reporting Accountants"), have implemented the relevant issues in the Inquiry Letter one by one. The response to the "Inquiry Letter" is as follows, please review.

Notes:

1. Unless otherwise specified, the abbreviations or definitions of terms in this response report are the same as those in the prospectus.

2. The fonts in this response report have the following meanings:

1. Minor differences between the sum of individual data in some tables of this Inquiry Letter response and the total count in the tables are due to rounding.

Table of Contents

Question 1: 3

Question 2: 98

Other Questions: 135

Question 1

The total amount of funds raised by the Company in this issuance of shares to specific targets does not exceed 2.76 billion RMB, intended for the annual production of 2,000 tons of base metal low-silver photovoltaic paste project (hereinafter referred to as Project 1), the next-generation high-efficiency photovoltaic cell metallization paste R&D project (hereinafter referred to as Project 2), the memory chip packaging and testing base project (hereinafter referred to as Project 3), the semiconductor packaging R&D center project (hereinafter referred to as Project 4), and the repayment of bank loans and replenishment of working capital.

Project 1 is mainly used for the production of TOPCon silver-copper paste and mixed nickel base metal paste, with a designed capacity of 1,500 tons for TOPCon silver-copper paste and 500 tons for mixed nickel base metal paste. The internal rate of return after income tax for this project is 18.03%, and the static investment payback period after tax is 10.04 years (including the construction period).

Project 2 is mainly used for the construction of an emerging photovoltaic paste R&D platform. The R&D direction is mainly focused on pure copper paste, perovskite/crystalline silicon stacked cell paste, low-recombination, high-efficiency, fine-line conductive silver paste applied to TBC cells, front-side conductive silver paste suitable for ultra-fine line steel plate printing, conductive silver paste suitable for TOPCon front-side transfer printing, and high-reliability space photovoltaic paste. The raised funds are mainly used for paying land transfer fees, constructing factory buildings, and purchasing R&D equipment. This project is an R&D project and does not directly generate economic benefits.

Project 3 is mainly used for the improvement of the Company's memory chip packaging and testing capacity. The raised funds are mainly used for factory construction and equipment procurement. After the completion of this project, it will add an annual packaging capacity of 85 million units, an FT testing capacity of 96 million units, and an aging testing capacity of 45 million units. The internal rate of return after income tax for this project is 12.61%, and the static investment payback period after tax is 7.62 years (including the construction period).