Securities Code: 300716
Securities Abbreviation: *ST Quanyou
Announcement No.: 2026-084
Guangdong Quanyou Technology Co., Ltd.
Announcement on Progress of Signing Beneficial Bond Financing Agreement
The company and the board of directors guarantee that the information disclosed in this report is true, accurate, and complete, and that there are no false records, misleading statements, or major omissions.
On June 24, 2026, Guangdong Quanyou Technology Co., Ltd. (hereinafter referred to as "the Company") announced the "Announcement on the Proposed Signing of Beneficial Bond Financing Agreement" (Announcement No. 2026-070). After discussion by the General Manager's Office, the Fourth Audit Committee meeting, and the Forty-seventh meeting of the Fourth Board of Directors, the Company planned to obtain beneficial bond financing from Guomin Trust Co., Ltd. (hereinafter referred to as Guomin Trust) and Beijing Yarong Chunya Technology Development Center (Limited Partnership) (hereinafter referred to as Yarong Chunya) for no more than RMB 60 million (in words: Sixty Million Yuan) and RMB 20 million (in words: Twenty Million Yuan) respectively. The progress is hereby announced as follows: