The company and all members of the board of directors guarantee the truthfulness, accuracy, and completeness of the information disclosed, and are free from any false representations, misleading statements, or material omissions.
ShengBang Microelectronics (Beijing) Co., Ltd. (hereinafter referred to as the "Company") is in the process of applying for an offshore issuance of shares (H shares) and listing on the Main Board of The Stock Exchange of Hong Kong Limited (hereinafter referred to as the "Hong Kong Stock Exchange") (hereinafter referred to as the "Proposed Offering and Listing").
On September 28, 2025, the Company submitted its application for the Proposed Offering and Listing to the Hong Kong Stock Exchange and published the application documents for the Proposed Offering and Listing on the website of the Hong Kong Stock Exchange on the same day. In accordance with the timeline for the Proposed Offering and Listing and the relevant regulations of the Hong Kong Stock Exchange, the Company submitted updated application documents for the Proposed Offering and Listing to the Hong Kong Stock Exchange on April 1, 2026, and published the updated application documents for the Proposed Offering and Listing on the website of the Hong Kong Stock Exchange on the same day. For details, please refer to the "Announcement on Submitting Application Documents for Offshore Issuance and Listing of H Shares to the Hong Kong Stock Exchange and Publishing Application Documents" (Announcement No.: 2025-097) and the "Announcement on Progress of Submitting Application Documents for Offshore Issuance and Listing of H Shares to the Hong Kong Stock Exchange" (Announcement No.: 2026-018) disclosed by the Company on the Juchao Information Network (http://www.cninfo.com.cn/new/index) on September 29, 2025, and April 2, 2026, respectively.