Huatai United Securities Co., Ltd.
Listing Sponsorship Letter Regarding Xiamen Hongxin Electronics Technology Group Co., Ltd.'s 2024 Issuance of Shares to Specific Objects and Listing on the ChiNext Market
To the Shenzhen Stock Exchange:
As the sponsor for Xiamen Hongxin Electronics Technology Group Co., Ltd. (hereinafter referred to as the "Issuer" or "Company") in its 2024 issuance of shares to specific objects and listing on the ChiNext market, Huatai United Securities Co., Ltd. and its sponsored representatives have, in accordance with the "Company Law of the People's Republic of China" (hereinafter referred to as the "Company Law"), the "Securities Law of the People's Republic of China" (hereinafter referred to as the "Securities Law"), and other relevant laws and regulations, and the requirements of the China Securities Regulatory Commission (hereinafter referred to as the "CSRC") and your esteemed exchange, honestly and diligently, in strict accordance with legally formulated business rules and industry self-regulatory norms, issued this listing sponsorship letter, and guarantees that the information provided is true, accurate, and complete.
The relevant situation is reported as follows:
I. Basic Information of the Issuer
(I) Overview of the Issuer
Company Name: Xiamen Hongxin Electronics Technology Group Co., Ltd.
Registered Address: 3rd Floor, Building 1#, No. 2, Xianghai Road, Xiang'an Industrial Zone, Torch High-tech Zone, Xiamen
Date of Establishment: September 8, 2003
Registered Capital Before This Issuance: 48,212.5646 million yuan
Legal Representative: Li Qiang
Contact Information: 86-592-3160382
Business Scope: Manufacturing of printed circuit boards; manufacturing of electronic special materials; manufacturing of computer hardware, software, and peripherals; information system integration services; integrated circuit design; integrated circuit manufacturing; integrated circuit sales; manufacturing of printed circuit boards and products; software development; artificial intelligence basic software development; sales of cloud computing equipment; manufacturing of cloud computing equipment; manufacturing of computing equipment; technical services, technology development, technical consulting, technical exchange, technology transfer, technology promotion; manufacturing of general-purpose components; manufacturing and sales of mobile terminal equipment; sales of new energy vehicle electrical accessories; production and sales of battery components; battery manufacturing; manufacturing of power electronic components; sales of power electronic components; sales of electronic components and electromechanical components; manufacturing and sales of plastic products; manufacturing of metal tools.
(II) Main Business of the Issuer
1. Overview of the Issuer's Main Business
The Company is a high-tech enterprise specializing in the research, development, design, manufacturing, and sales of printed circuit boards (including flexible printed circuit boards and rigid-flex PCBs) and backlight modules. It is located in the upstream and midstream of the consumer electronics and automotive electronics industries. Since its establishment, the Company's products have been indirectly or directly used in smartphones, tablet computers, and in-vehicle, industrial control, and other fields through display modules, touch modules, fingerprint recognition modules, and display screens. The Company's main customers include leading manufacturers such as BOE, Tianma, TCL Technology, and Visionox. The Company is also expanding into the automotive electronics field. After 20 years of growth and operation, the Company has become a well-known FPC manufacturing enterprise with leading domestic technology, strong capabilities, high production volume and output value, and first-class comprehensive strength.