[Chart: Minde Electronics Logo]
Minde Electronics
Shenzhen Minde Electronics Technology Co., Ltd.
and
Great Wall Securities Co., Ltd.
Regarding
Reply Report on the Audit Inquiry Letter for the Application for Issuance of Shares to Specific Objects by Shenzhen Minde Electronics Technology Co., Ltd.
Sponsor (Lead Underwriter)
(10-19th Floor, South Tower, Energy Building, No. 2026 Jintian Road, Futian Street, Futian District, Shenzhen)
August 2026
Shenzhen Stock Exchange:
Shenzhen Minde Electronics Technology Co., Ltd. (hereinafter referred to as the "Company," "Issuer," or "Minde Electronics") received the "Audit Inquiry Letter Regarding the Application for Issuance of Shares to Specific Objects by Shenzhen Minde Electronics Technology Co., Ltd." (Audit Letter [2026] No. 020060) (hereinafter referred to as the "Inquiry Letter") issued by your exchange on July 16, 2026. The Company, in conjunction with Great Wall Securities Co., Ltd. (hereinafter referred to as "Great Wall Securities," "Sponsor," or "Sponsoring Institution"), Guangdong Huashang Law Firm (hereinafter referred to as "Lawyer" or "Issuer's Lawyer"), and Lixin Certified Public Accountants (Special General Partnership) (hereinafter referred to as "Accountant" or "Reporting Accountant"), has conducted a thorough study and implementation, and has supplemented information and provided responses to the matters involved in accordance with the requirements of the Inquiry Letter. We hereby submit this report to your exchange for review.
Unless the context otherwise requires, the abbreviations used in this reply have the same meanings as those defined in the "Shenzhen Minde Electronics Technology Co., Ltd. 2026 Annual Prospectus for Issuance of A-Shares to Specific Objects (Declaration Draft)" (hereinafter referred to as the "Prospectus").
The font specifications for this reply are as follows:
| Category | Font |
|---|---|
| Questions listed in the Inquiry Letter | Bold |
| Responses to questions in the Inquiry Letter | Songti |
| Supplementary disclosures and amendments to application documents such as the Prospectus | Kai-ti, Bold |
In this reply, some totals may differ slightly from the sum of individual figures due to rounding in the calculation process.
Table of Contents
Question 1: 3
Other Matters: 95
Question 1
The total amount of funds to be raised in this issuance shall not exceed 1 billion RMB (inclusive). After deducting issuance expenses, the funds will be invested in the "Specialty High-Voltage Power Semiconductor Device and Power Integrated Circuit Wafer Foundry Project" (hereinafter referred to as "Project 1"), as well as for supplementing working capital and repaying bank loans.
The implementation entity for this fundraising project is the Issuer's holding subsidiary, Zhejiang Guangxin Microelectronics Co., Ltd. (hereinafter referred to as "Guangxin Microelectronics"). As of the end of the reporting period, the Issuer holds 50.10% of the shares of Guangxin Microelectronics. On May 9, 2026, and June 26, 2026, the Issuer disclosed twice the "Announcement on Capital Increase of Holding Subsidiary and Waiver of Preemptive Subscription Rights." Guangxin Microelectronics intends to introduce investors such as Huaxi Yinfeng Investment Co., Ltd. through capital increase and share expansion. After the completion of the aforementioned capital increase, the Issuer's equity ratio in Guangxin Microelectronics will decrease to 42.3380%. This fundraising project will be implemented through loans provided by the Issuer to Guangxin Microelectronics, with minority shareholders not providing loans in the same proportion.