Zhong De Securities Co., Ltd. Listing Sponsorship Letter for Wenzhou Hongfeng Electrical Alloy Co., Ltd.'s 2026 Private Placement of A Shares

Zhong De Securities Co., Ltd. Listing Sponsorship Letter for Wenzhou Hongfeng Electrical Alloy Co., Ltd.'s 2026 Private Placement of A Shares

Sponsorship Institution and Sponsor Representative Statement

Zhong De Securities Co., Ltd. (hereinafter referred to as "Zhong De Securities," "Sponsoring Institution," or "this Sponsoring Institution") has been entrusted by Wenzhou Hongfeng Electrical Alloy Co., Ltd. (hereinafter referred to as "Wenzhou Hongfeng," "the Company," or "the Issuer") to serve as the sponsoring institution for this private placement of A shares by Wenzhou Hongfeng. Yang Wei and Fan Jiani have been appointed as the sponsor representatives for this sponsorship work. Zhong De Securities and the sponsor representatives hereby make the following commitments:

Zhong De Securities and its sponsor representatives have, in accordance with the "Company Law of the People's Republic of China" (hereinafter referred to as the "Company Law"), the "Securities Law of the People's Republic of China" (hereinafter referred to as the "Securities Law"), the "Administrative Measures for the Registration of Securities Issuances by Listed Companies" (hereinafter referred to as the "Registration Measures"), and other relevant laws and regulations, as well as the regulations of the China Securities Regulatory Commission (hereinafter referred to as the "CSRC") and the Shenzhen Stock Exchange (hereinafter referred to as the "SZSE"), acted with honesty and diligence, and have strictly followed the legally established business rules and industry self-regulatory norms in issuing this listing sponsorship letter, ensuring that the information provided is true, accurate, and complete.

Unless otherwise specified, the terms used in this listing sponsorship letter have the same meaning as in the "Prospectus for Wenzhou Hongfeng Electrical Alloy Co., Ltd.'s 2026 Private Placement of A Shares."

Table of Contents

Sponsorship Institution and Sponsor Representative Statement

Table of Contents

1. Issuer Information

2. Information on the Issuer's Current Offering

3. Information on Sponsor Representatives, Coordinators, and Other Project Team Members for this Securities Issuance and Listing

4. Explanation of the Sponsoring Institution's Relationship with the Issuer

5. Commitments of the Sponsoring Institution

6. Decision-Making Procedures for this Securities Issuance and Listing

7. Explanation of Compliance with Listing Conditions for this Securities Issuance

8. Work Arrangements for the Sponsor's Continued Supervision Period

9. Recommendation Conclusion of the Sponsoring Institution for this Securities Issuance and Listing

1. Issuer Information

(1) Basic Information of the Issuer

(2) Issuer's Main Business

The Company's main business is the research and development, production, sales, and service of new material technologies. The Company is committed to providing comprehensive solutions for customers in the field of functional composite materials for new alloys.