Important Statement
The content of this report prepared by Zhong De Securities Co., Ltd. (hereinafter referred to as "Zhong De Securities") is derived from publicly disclosed information by the issuer.
This report does not constitute a recommendation for investors to take or not take any action. Investors should make independent judgments on relevant matters and should not use any content in this report as a commitment or statement made by Zhong De Securities.
I. Basic Information of the Company Bond
(I) Issuer: Beijing E-Hualu Information Technology Co., Ltd.
(II) Full Bond Name: Beijing E-Hualu Information Technology Co., Ltd. 2022 Publicly Issued Corporate Bonds for Professional Investors (New Infrastructure) (Phase I), Short Name: "22 Hualu 01" (hereinafter referred to as "this bond").
(III) Issuance Scale: The issuance scale of this bond is RMB 500 million.
(IV) Face Value and Issuance Price: The face value of this bond is RMB 100, and it is issued at par.
(V) Bond Term: The term of this bond is 5 years, with options for the issuer to adjust the coupon rate at the end of the third year and for investors to sell back.
(VI) Bond Interest Rate and Determination Method: The coupon rate of this bond is 3.80%. The bond interest rate is calculated on a simple interest basis annually, without compounding.
(VII) Interest Accrual Date: August 17, 2022.
(VIII) Interest Payment Date: The interest payment date for this bond is August 17th of each year from 2023 to 2027 (if it falls on a statutory or government-designated holiday or rest day, it will be postponed to the first trading day thereafter; no additional interest will be accrued on the postponed interest payment). If investors exercise the put option, the interest payment date for the repurchased bonds will be August 17th of each year from 2023 to 2025 (if it falls on a statutory or government-designated holiday or rest day, it will be postponed to the first trading day thereafter; no additional interest will be accrued on the postponed interest payment).
(IX) Redemption Date: The redemption date for this bond is August 17, 2027 (if it falls on a statutory or government-designated holiday or rest day, it will be postponed to the first trading day thereafter; no additional interest will be accrued on the postponed redemption payment).
(X) Credit Enhancement Measure: This bond is fully and unconditionally guaranteed by China Hualu Group Co., Ltd. with joint and several liability.