Announcement on Company Applying for M&A Loan from Bank

Securities Code: 300005 Securities Abbreviation: Explore Number: Announcement [blank] Explore Holding Group Co., Ltd. Announcement on Company Applying for M&A Loan from Bank The Company and all members of the Board of Directors guarantee that the information disclosed is true, accurate, and complete, and that there are no false records, misleading statements, or major omissions. I. Overview Explore Holding Group Co., Ltd. (hereinafter referred to as the "Company") reviewed and approved the "Proposal on Acquiring 51% Equity of Shanghai Tongtu Semiconductor Technology Co., Ltd." at the tenth meeting of the sixth Board of Directors. The Company agreed to use its own funds of RMB 357 million to acquire 51% equity of Shanghai Tongtu Semiconductor Technology Co., Ltd. (hereinafter referred to as "Shanghai Tongtu") held by Du Junli, Wang Hongjian, Lin Jiang, and Chen Tao. For details, please refer to the "Announcement on Equity Acquisition" disclosed by the Company on the Juchao Information Network (www.cninfo.com.cn) (Announcement No.: [blank]). In January 2026, Shanghai Tongtu completed the industrial and commercial change registration procedures for this acquisition. The Company became a shareholder of Shanghai Tongtu, holding 51% of its equity, and included it in its consolidated financial statements. Shanghai Tongtu became a holding subsidiary of the Company. To promote the acquisition of Shanghai Tongtu equity and optimize the financing structure, considering the current operating conditions and fund usage arrangements, the Company plans to apply to the Beijing Branch of Xiamen International Bank Co., Ltd. (hereinafter referred to as "Xiamen International Beijing Branch") for an M&A loan of no more than RMB 249.9 million to pay for part of the transaction price of the Company's acquisition of 51% equity in Shanghai Tongtu or to replace the acquisition price already paid. The specific loan amount, interest rate, and term will be subject to the relevant agreement signed by the Company and the bank. The Company now plans to pledge its 51% equity in Shanghai Tongtu to provide an equity pledge guarantee for the M&A loan of RMB 249.9 million (hereinafter referred to as the "M&A Loan") applied by the Company from Xiamen International Beijing Branch for the acquisition of Shanghai Tongtu equity. In addition, the Company's wholly-owned subsidiary Beijing Explore Outdoor Products Sales Co., Ltd. (hereinafter referred to as "Beijing Explore") will provide a joint liability guarantee for the Company's M&A loan. The guarantee period will be from the effective date of the "Guarantee Agreement" until three years after the expiration of the debt repayment period under the "M&A Loan Agreement" (collectively referred to as the "Financing Matter"). The Company held the eleventh meeting of the sixth Board of Directors on February 13, 2026, and reviewed and approved the "Proposal on Applying for a Comprehensive Credit Line from Banks and Other Financial Institutions." It was agreed that within one year from the date of approval of this Board meeting, the Company and its holding subsidiaries will apply for a comprehensive credit line from financial institutions totaling no more than RMB 1.8 billion. The amount of the Company's M&A loan is within the credit li