Announcement on Applying for an M&A Loan from a Bank

*ST Shengxun Co., Ltd.·June 26, 2026·2 pages

✨ AI Summary

Beijing Sound Electronics Co., Ltd. will apply for an M&A loan of up to RMB 180 million to fund the acquisition of a 51% stake in Wuhan Zhongke Ruize Optoelectronics Technology Co., Ltd. The loan aims to optimize financing structure and improve capital efficiency. The board has authorized management to handle the loan application process.

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Full Translation

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Securities Code: 003004

Bond Code: 127080

Securities Abbreviation: Sound Electronics Stock

Bond Abbreviation: Sound Electronics Convertible Bond

Announcement Number: 2026-048

Beijing Sound Electronics Co., Ltd.

Announcement on Applying for an M&A Loan from a Bank

The Company and all members of the Board of Directors guarantee that the information disclosed is true, accurate, and complete, and that there are no false records, misleading statements, or major omissions.

Beijing Sound Electronics Co., Ltd. (hereinafter referred to as the "Company") held the 36th meeting of the Fifth Board of Directors on June 26, 2026, and reviewed and approved the "Proposal on Applying for an M&A Loan from a Bank." The specific details are hereby announced as follows:

I. Basic Situation of the Company's M&A Transaction

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