Stock Code: 002674 Stock Abbreviation: Xingye Technology Announcement Number: 2026-034 Xingye Leather Technology Co., Ltd. Announcement on Voluntary Information Disclosure Regarding the Signing of a Framework Agreement for the Acquisition of Indium Phosphide Business Assets The Company and all members of the Board of Directors guarantee the truthfulness, accuracy, and completeness of the information disclosed herein, without false records, misleading statements, or material omissions. Special Note:
- The Company has currently only signed a "Framework Agreement" with the counterparty. The acquisition of the indium phosphide business assets by the Company will be submitted to the Board of Directors for review after relevant transaction details are confirmed. It is anticipated that this matter will not have a substantial impact on the Company's current operating performance.
- The Company has no R&D, production, operation, or market expansion management experience in the field of semiconductor new materials. Indium phosphide substrates are core materials for compound semiconductors, characterized by high R&D investment, high barriers to core technology, patents, and technical talent. Risks may include high R&D investment, technology breakthroughs falling short of expectations, and product yield and performance failing to meet market standards. Furthermore, the current global indium phosphide substrate market is highly concentrated, with leading overseas manufacturers holding major market share. The customer certification cycle is long, and the entry barrier is high, which may lead to slow market development, delayed customer certification, and intensified market competition.
- The Company will fulfill its information disclosure obligations in accordance with relevant regulations based on the progress of the agreement. Investors are advised to make prudent decisions and be aware of investment risks. I. Overview of the Framework Agreement Signing Recently, Xingye Leather Technology Co., Ltd. (hereinafter referred to as "the Company" or "Xingye Technology") and Qingdao Leapond Crystal Semiconductor Technology Co., Ltd. (hereinafter referred to as "Qingdao Leapond"), among other parties, jointly signed the "Framework Agreement for the Acquisition of Indium Phosphide Business Assets" (hereinafter referred to as the "Framework Agreement"). The Company intends to acquire the R&D, manufacturing, and sales business of indium phosphide substrates and semiconductor electronic materials from Qingdao Leapond. The scope of acquisition includes, but is not limited to, all assets related to this business, the relevant business team, intellectual property rights such as patents, trademarks, and proprietary technologies, as well as ongoing business contracts. According to the "Shenzhen Stock Exchange Stock Listing Rules" and the "Company Articles of Association," the Company's signing of this "Framework Agreement" does not constitute a related-party transaction or a major asset restructuring, and therefore does not require submission to the Company's Board of Directors and Shareholders' Meeting for review. The Company will fulfill necessary approval procedures and information disclosure obligations in accordance with regulations based on the progress of subsequent cooperation. II. Introduction of the Counterparty Company Name: Qingdao Leapond Crystal Semiconductor Techn