002579SZSE
🚨 Material Event

Listing Sponsor Letter

✨ AI Summary

This document is a listing sponsor letter from Shenwan Hongyuan Securities for Huizhou CEE Technology Inc.'s issuance of shares to specific targets and listing on the main board. It details the company's basic information, business, financial data, risks, and the specifics of the issuance, confirming compliance with regulations. The letter concludes with the sponsor's recommendation for the listing.

Summary generated by AI · Always verify with source document

Full Translation

AI Translation· gemini_document

Shenwan Hongyuan Securities Underwriting and Sponsorship Co., Ltd.

Regarding

Huizhou CEE Technology Inc.

Issuance of Shares to Specific Targets and Listing on the Main Board

Listing Sponsor Letter

Sponsor:

SHENWAN HONGYUAN FINANCING SERVICES CO., LTD

June 2026

Shenwan Hongyuan Securities Underwriting and Sponsorship Co., Ltd. and its sponsor representatives have, in accordance with the "Company Law of the People's Republic of China" (hereinafter referred to as the "Company Law"), the "Securities Law of the People's Republic of China" (hereinafter referred to as the "Securities Law"), the "Administrative Measures for the Business of Securities Issuance and Underwriting" (hereinafter referred to as the "Underwriting Measures"), the "Administrative Measures for Securities Issuance and Listing" (hereinafter referred to as the "Registration Measures"), the "Rules Governing the Listing of Stocks on the Shenzhen Stock Exchange," and other relevant laws and regulations, as well as the relevant regulations of the China Securities Regulatory Commission and the Shenzhen Stock Exchange, acted in good faith, diligently, and responsibly, and have issued this listing sponsor letter in strict accordance with the legally formulated business rules and industry self-regulatory norms, ensuring that the information provided is true, accurate, and complete.

The relevant situation is hereby reported as follows:

I. Basic Information of the Issuer

(I) Basic Data

Company Name: Huizhou CEE Technology Inc.

English Name: Huizhou CEE Technology Inc.

Abbreviated Name of Company A Shares: CEE Technology

Stock Code of Company A Shares: 002579.SZ

Stock Listing Location: Shenzhen Stock Exchange

Legal Representative: Yang Lin

Secretary of the Board: Song Gang

Registered Capital: RMB 612,618,620.00 (before the issuance of shares to specific targets)

Registered Address: Chenjiang Street, High-tech Zone, Huizhou City, Guangdong Province, Dong Sheng South Road No. 6

Office Address: Chenjiang Street, High-tech Zone, Huizhou City, Guangdong Province, Dong Sheng South Road No. 6

Date of Establishment: December 22, 2000

Date of Listing: May 6, 2011

Telephone: 0752-2057992

Fax: 0752-2057992

Company Website: http://www.ceepcb.com/

Company Email: obd@ceepcb.com

Business Scope: General items: Manufacturing of electronic components; wholesale of electronic components; retail of electronic components; research and development of electronic special materials; manufacturing of electronic special materials; sales of electronic special materials; manufacturing of integrated circuit chips and products; sales of integrated circuit chips and products; manufacturing of optoelectronic devices; sales of optoelectronic devices; manufacturing of power electronic components; sales of power electronic components; research and development of emerging energy technologies; import and export of goods; technical services, technology development, technical consulting, technology exchange, technology promotion. (Except for projects that require approval according to law, business activities are carried out independently according to the business license) Licensed projects: Inspection and testing services. (Projects that require approval according to law can only be carried out after approval by the relevant departments, and the specific business projects are subject to the approval documents or licenses of the relevant departments) (The above projects do not involve foreign investment access special management measures)

(II) Main Business of the Issuer

During the reporting period, the issuer's main business was the research, development, production, sales, and service of printed circuit boards (PCBs). It is positioned in the high-end application market and is characterized by high precision, high density, and high reliability. The company has a rich product structure and a wide range of product applications, used in consumer electronics, communication electronics, high-end displays, medical security, industrial control, automotive electronics, and other fields. The company is currently one of the few PCB manufacturers in China that possesses both mass production capabilities for rigid-flex PCBs and strong R&D capabilities, able to meet customers' diverse product portfolio needs and respond quickly to new product development, providing customers with integrated product and technology solutions.

Sign in to read the full translation

Free accounts get 10 full releases per month. Pro subscribers get unlimited access.