Stock Abbreviation: Fastprint Stock Code: 002436
Shenzhen Fastprint Circuit Tech Co., Ltd. (hereinafter referred to as the "Company" or "Fastprint") intends to issue A-shares to specific targets to raise funds to meet the capital requirements for the implementation of its business strategy and business development, further enhance its capital strength, optimize its capital structure, and improve its profitability. In accordance with the Company Law of the People's Republic of China, the Securities Law of the People's Republic of China, the Administrative Measures for the Issuance of Securities by Listed Companies, and other relevant laws, regulations, departmental rules, and the Articles of Association, the Company has prepared this Feasibility Analysis Report on the 2026 Private Placement of A-Shares for Investment Projects.
Unless otherwise specified, relevant terms have the same meanings as those in the "Shenzhen Fastprint Circuit Tech Co., Ltd. 2026 Private Placement of A-Shares Plan".
I. Investment Plan for Proceeds from this Offering
The total amount of funds raised from this offering shall not exceed 3.9 billion RMB (inclusive). After deducting issuance expenses, the net proceeds are intended to be invested in the following projects:
| No. | Project Name | Implementing Entity | Total Project Investment | Proposed Investment of Proceeds |
|---|---|---|---|---|
| 1 | Zhuhai Fastprint Semiconductor Co., Ltd. High-end mSAP Substrate Intelligent Manufacturing and Industrialization Project (Phase I) | Zhuhai Fastprint | 200,261.60 | 200,000.00 |
| 2 | Zhuhai Fastke Semiconductor Co., Ltd. IC Packaging Substrate Project (Phase III) | Zhuhai Fastke | 117,839.10 | 110,000.00 |
| 3 | Supplementing working capital and repaying bank loans | Fastprint | 80,000.00 | 80,000.00 |
| Total | 398,100.70 | 390,000.00 |
Before the proceeds from this offering are in place, the Company will use its own or self-raised funds to make advance investments based on the actual progress of the projects, and will replace them in accordance with relevant laws, regulations, departmental rules, and normative documents after the proceeds are in place. If the actual proceeds after deducting issuance expenses are less than the total amount proposed to be invested, the Board of Directors and its authorized persons may, within the scope of the above investment projects, adjust and finally decide on the priority of the investment of proceeds and the specific investment amount for each project based on the progress of the projects and actual capital needs. Any shortfall will be covered by the Company through self-raised funds.
If the total amount of funds raised from this offering is adjusted due to changes in regulatory policies or the requirements of issuance registration documents, the proposed investment amount for each project will be adjusted accordingly.
II. Necessity and Feasibility Analysis of the Investment Projects
(I) Zhuhai Fastprint Semiconductor Co., Ltd. High-end mSAP Substrate Intelligent Manufacturing and Industrialization Project (Phase I)
- Project Overview
| Category | Content |
|---|---|
| Project Name | Zhuhai Fastprint Semiconductor Co., Ltd. High-end mSAP Substrate Intelligent Manufacturing and Industrialization Project (Phase I) |
| Implementing Entity | Zhuhai Fastprint Semiconductor Co., Ltd. |
| Total Investment | 200,261.60 ten thousand RMB |
| Main Construction Content | After the project reaches production, it will add a monthly capacity of 10,000 square meters of mSAP substrates, expanding the production scale of optical module substrates |
| Construction Location | No. 888, Sanhu Avenue, Nanshui Town, Jinwan District, Zhuhai City, within the Zhuhai Fastprint Technology Co., Ltd. park |
- Necessity of Project Implementation
(1) Seizing Market Opportunities in Frontier Application Fields
This project plans to add an annual capacity of 120,000 square meters of mSAP substrates to expand the production scale of optical module substrates. The market demand for mSAP substrates for optical modules shows a trend of rapid growth, high-end development, and supply shortages. Accelerated capital expenditure in terminal data centers and the subsequent expansion of the optical module market have become the core drivers for the market scale expansion of the high-speed optical module component industry.