Shenzhen Fastprint Circuit Technology Co., Ltd. (hereinafter referred to as "the Company" or "Fastprint Technology") plans to issue A shares to specific objects and raise capital to meet the funding needs for the implementation of its business strategy and business development, further enhance its capital strength, optimize its capital structure, and improve its profitability, in accordance with the "Company Law of the People's Republic of China," "Securities Law of the People's Republic of China," "Administrative Measures for Issuance Registration of Securities by Information Disclosure Companies," and other relevant laws, regulations, departmental rules, normative documents, and the "Articles of Association." The net proceeds from the issuance, after deducting issuance expenses, are intended to be used for the "Zhuhai Fastprint Semiconductor Co., Ltd. High-end mSAP Substrate Intelligent Manufacturing and Industrialization Project (Phase I)," "Zhuhai Fastprint Semiconductor Co., Ltd. Integrated Circuit Packaging Substrate Project (Phase III)," supplementing working capital, and repaying bank loans.
Unless otherwise specified, the terms used herein have the same meanings as defined in the "Shenzhen Fastprint Circuit Technology Co., Ltd. 2026 Plan for Issuing A Shares to Specific Objects."
I. Background and Objectives of the Issuance (I) Background of the Issuance
- China's PCB Industry is Growing Rapidly with Great Potential Printed Circuit Board (PCB) refers to a printed board formed by connecting points on a general substrate according to a predetermined design. Its main functions are: (1) to provide mechanical support for various components on the circuit; (2) to connect various electronic components through the circuit, enabling conduction and transmission; and (3) to mark the installed components with symbols, facilitating insertion, inspection, and debugging. PCBs can interconnect electronic components, acting as a relay and transmission medium, and are the support for electronic components and key electronic interconnectors for electronic products. Almost every electronic device relies on PCBs, as they provide mechanical support for fixing and assembling various electronic components, realize the wiring and electrical connections or electrical insulation between them, and provide the required electrical characteristics. Their manufacturing quality directly affects the stability and lifespan of electronic products, and influences the overall competitiveness of system products, earning them the title of "mother of electronic products." As an indispensable component of electronic terminal devices, the development level of the PCB industry reflects the speed and technological standards of the electronic information industry in a country or region to a certain extent.
The PCB industry is the largest segment in terms of output value within the global electronic components industry. In 2024, the global PCB output value is expected to reach US$73.565 billion. In 2025, the global PCB output value is projected to reach US$85.836 billion, an increase of 16.7% year-on-year.
Driven by factors such as decarbonization and intelligence, downstream application industries for PCBs, such as servers and high-speed network infrastructure, are expected to continue to thrive, driving sustained growth in PCB demand. According to Prismark's forecast, the global PCB market is expected to maintain a stable growth trend over the next five years, with an estimated compound annual growth rate (CAGR) of 11.0% from 2025 to 2030, and the global PCB market is projected to reach US$144.610 billion by 2030. The following chart shows the global PCB industry output value and its changes from 2014 to 2030.
[Chart: Global PCB output value and growth rate]
From a regional perspective, mainland China's market performance is superior to other regions. The proportion of mainland China's PCB output value to the global total output value has increased from 8.1% in 2000 to 57.8% in 2025, making it the main production and supply hub for PCBs globally. According to Prismark's forecast, mainland China will continue to maintain its position as a global manufacturing center. The PCB industry in mainland China is expected to continue growing over the next five years, with a projected CAGR of 10.5% from 2025 to 2030, and mainland China's PCB output value is expected to reach US$81.764 billion by 2030.