002213SZSE
🚨 Material Event

Shenzhen Great Wall Innovation Technology Co., Ltd. 2026 Annual Simplified Procedure Issuance to Specific Objects A Share Stock Plan Argument Analysis Report (Revised Draft)

Daiwei Co., Ltd.··21 pages

✨ AI Summary

Shenzhen Great Wall Innovation Technology Co., Ltd. is issuing A shares to specific objects via a simplified procedure to raise RMB 108.5 million. The funds will support the R&D and industrialization of embedded storage products, aligning with national policy and enhancing core competitiveness. This issuance aims to strengthen capital, optimize structure, and boost market competitiveness.

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Securities Code: 002213 Securities Abbreviation: Great Wall Shares Great Wall Shares DAWEI TECHNOLOGY Shenzhen Great Wall Innovation Technology Co., Ltd. 2026 Annual Simplified Procedure Issuance to Specific Objects A Share Stock Plan Argument Analysis Report (Revised Draft) June 2026 1

Shenzhen Great Wall Innovation Technology Co., Ltd. (hereinafter referred to as "Great Wall Shares" or "the Company") to meet the capital needs for the implementation of the Company's business strategy and development, further enhance the Company's capital strength, optimize its capital structure, and improve its market competitiveness, in accordance with the "Company Law of the People's Republic of China" (hereinafter referred to as the "Company Law"), the "Securities Law of the People's Republic of China" (hereinafter referred to as the "Securities Law"), and the "Administrative Measures for the Registration of Issuance of Securities by Listed Companies" (hereinafter referred to as the "Registration Measures") and other relevant laws, regulations, and normative documents, the Company plans to issue A shares to specific objects through a simplified procedure, with a total capital raised of RMB 10,850.00 million. A justification analysis report for the issuance plan to specific objects through a simplified procedure has been compiled. (Unless otherwise specified in this justification analysis report, the terms used herein have the same meaning as in the "Shenzhen Great Wall Innovation Technology Co., Ltd. 2026 Annual Plan for Issuance of A Shares to Specific Objects Through Simplified Procedures (Revised Draft)")

I. Background and Objectives of the Current Issuance (I) Background of the Current Issuance

  1. The Company Continues to Promote Independent Innovation and Growth in the Semiconductor Memory Business One of the Company's core businesses is the design and sale of semiconductor memory devices. In recent years, the Company has fully committed to making the semiconductor memory business a core growth driver for its high-quality development. To quickly enter the semiconductor memory field and considering the industry ecosystem characteristic of "few original manufacturers and numerous customers" in the global semiconductor memory industry, the Company participates in the distribution of semiconductor memory devices. Through years of distribution operations, the Company has continuously deepened its understanding of the semiconductor memory industry, products, and customers. It has accumulated high-quality customer resources and supply chain resources, covering various fields such as consumer electronics and data centers, thereby building a relatively mature sales network for semiconductor memory business, which lays the channel foundation for the sales of the Company's self-developed embedded memory products. At the same time, the Company has formulated a development plan for the coordinated promotion of self-development and distribution of semiconductor memory devices to further enhance its core competitiveness. To achieve self-sufficiency and control in semiconductor memory devices, the Company has assembled a senior R&D and testing team to focus on the research, development, and industrialization of embedded memory devices. To date, the Company has independently developed core products such as eMMC 64GB, DDR4 8Gb, and LPDDR4X 4GB, which have been mass-produced and delivered. It has also completed the R&D work for LPDDR5 and eMMC 128GB/256GB, and has initiated the R&D of embedded memory products such as UFS2.2. In the future, the Company will continue to increase R&D investment and technological breakthroughs.

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