Shenzhen Dawi Innovation Technology Co., Ltd. (hereinafter referred to as "Dawi" or "the Company") intends to issue A shares to specific objects via a simplified procedure to meet the funding needs for implementing its business strategy and enhancing its capital strength, optimizing its capital structure, and improving market competitiveness. The total amount of funds to be raised is RMB 108.5 million, and an analysis report on the plan for issuing A shares to specific objects has been prepared. (Unless otherwise specified in this analysis report, relevant terms have the same meaning as in the "Plan for Issuing A Shares to Specific Objects via Simplified Procedures in 2026" of Shenzhen Dawi Innovation Technology Co., Ltd.)
I. Background and Purpose of the Issuance
1. Background of the Issuance
- The Company continues to promote independent innovation in the semiconductor storage business and strengthen its core main business, which is the design and sales of semiconductor memory. In recent years, the Company has focused on making the semiconductor storage business a core growth driver for high-quality development. To quickly enter the semiconductor storage field and in line with the industry's ecological characteristics of "few original manufacturers and numerous customers," the Company participates in the distribution of semiconductor memory. Through years of distribution operations, the Company has deepened its understanding of the semiconductor memory industry, products, and customers, accumulating a quality customer base and supply chain resources covering various fields such as consumer electronics and data centers, thus establishing a relatively mature sales network for semiconductor storage business, laying a foundation for the sales of self-developed embedded storage products. At the same time, the Company has formulated a development plan for the coordinated advancement of self-research and distribution of semiconductor memory, further enhancing its core competitiveness. To achieve controllable autonomy in semiconductor memory, the Company has assembled a senior R&D and testing team, focusing on the technological R&D and industrialization of embedded storage products. To date, the Company has independently developed core products such as eMMC 64GB, DDR4 8Gb, and LPDDR4X 4GB, which have been delivered in bulk, and has initiated the R&D of embedded storage products such as LPDDR5, eMMC 128GB/256GB, and UFS2.2. In the future, the Company will continue to increase R&D investment and tackle technological challenges. On one hand, it will enhance the technological level of high-capacity storage products through independent innovation, improve the product matrix, and meet downstream customers' higher requirements for product performance and reliability. On the other hand, it will leverage its independent R&D capabilities to upgrade its service model from single product supply to customized adaptation and comprehensive solutions, enhancing customer demand response speed and supply chain collaboration efficiency. Against this backdrop, this issuance represents the Company's continued investment in its main business and the deepening of its development strategy and planning. Through this issuance, the Company will further strengthen its independent R&D capabilities, enhance its core technological innovation capabilities, and continue to promote the independent innovation and growth of its semiconductor storage business.