1. Fundraising Plan
Shenzhen Laibo High-Tech Co., Ltd. (hereinafter referred to as "the Company") plans to raise a total of no more than 250 million yuan (including this amount) through a targeted issuance of A-shares in 2026 (hereinafter referred to as "this issuance"). After deducting issuance costs, the raised funds are intended for the following projects:
| No. | Project Name | Total Investment Amount (10,000 yuan) | Amount of Raised Funds (10,000 yuan) |
|---|---|---|---|
| 1 | Micro-cavity Electronic Paper Device (MED) Project | 900,000.00 | 180,000.00 |
| 2 | Supplementing Working Capital | 70,000.00 | 70,000.00 |
| Total | 970,000.00 | 250,000.00 |