Securities abbreviation: Guanghe Technology
Stock code: 001389
DELTON
TECHNOLOGY 广合科技
Guangzhou Delton Technology Co., Inc.
(No. 22 Baoying South Road, Free Trade Zone, Huangpu District, Guangzhou, Guangdong Province)
Analysis Report on the Feasibility of Raising Funds for Issuing A-share Convertible Bonds to Unspecified Targets (Revised)
August 2026
TABLE OF CONTENTS
Glossary
Section 1 Plan for the Use of Raised Funds
Section 2 Specifics of Projects to Be Funded by Raised Capital
I. Yunqing Smart Manufacturing Base Project (Phase II)
II. High-Layer Printed Circuit Board Project
III. Supplementing Working Capital
Section 3 Impact of This Issuance on the Company's Operations and Financial Status
I. Impact of Issuing Convertible Bonds to Unspecified Targets on the Company's Operations
II. Impact of Issuing Convertible Bonds to Unspecified Targets on the Company's Financial Status
Section 4 Conclusion on Feasibility
Glossary
Unless otherwise specified, the following abbreviations have the meanings set forth in this report:
| Term | Meaning |
|---|---|
| Guanghe Technology, the Company, the Issuer, the Listed Company | Guangzhou Delton Technology Co., Inc. |
| Convertible Bonds | Convertible corporate bonds |
| Issuance, This Issuance, This Issuance of Convertible Bonds to Unspecified Targets | The act of Guangzhou Delton Technology Co., Inc. issuing A-share convertible bonds to unspecified targets |
| This Report | Analysis Report on the Feasibility of Fund Utilization for Guangzhou Delton Technology Co., Inc.'s Issuance of A-share Convertible Bonds to Unspecified Targets |
| RMB, Ten Thousand Yuan, Hundred Million Yuan | Renminbi, Ten Thousand Yuan, Hundred Million Yuan |
Section 1 Plan for the Use of Raised Funds
The total amount of raised funds for this issuance of A-share convertible bonds to unspecified targets shall not exceed RMB 3,600,000,000.00 (inclusive). After deducting issuance expenses, the net amount of raised funds will be invested in the following projects:
Unit: Ten Thousand Yuan
| No. | Project Name | Total Investment | Raised Funds to be Invested |
|---|---|---|---|
| 1 | Yunqing Smart Manufacturing Base Project (Phase II) | 198,359.09 | 185,000.00 |
| 2 | High-Layer Printed Circuit Board Project | 155,992.17 | 100,000.00 |
| 3 | Supplementing Working Capital | 75,000.00 | 75,000.00 |
| Total | 429,351.26 | 360,000.00 |
Prior to the completion of fundraising for this issuance of A-share convertible bonds, the Company will make advance investments using its own funds or self-raised funds based on the actual progress of the investment projects. These advances will be replaced according to legal and regulatory procedures once the raised funds are in place.
The portion of the total project investment exceeding the net amount of raised funds will be resolved by the Company using its own funds or self-raised funds. Within the scope of the aforementioned investment projects, the board of directors or its authorized personnel may make appropriate adjustments to the specific amounts of the corresponding investment projects based on the project progress and funding needs.
Section 2 Specifics of Projects to Be Funded by Raised Capital
I. Yunqing Smart Manufacturing Base Project (Phase II)
(I) Project Overview
The project has a planned investment of RMB 198,359.09 million, of which RMB 185,000.00 million will be raised through the issuance of A-share convertible bonds to unspecified targets. This project will involve the procurement of high-end PCB production, testing, and supporting equipment to expand the production capacity of high-layer boards, high-end HDI boards, and other products for the server field, meeting the demands of industry technology upgrades and optimizing regional production layout, thereby enhancing the Company's overall competitiveness. This project will be implemented by Guanghe Technology.
(II) Necessity of Project Implementation