001232SZSE
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Guotai Haitong Securities Co., Ltd. Listing Sponsorship Letter Regarding the Initial Public Offering and Main Board Listing of Shenzhen JLC Technology Group Co., Ltd.

Shenzhen JLC Technology Group Co., Ltd.··30 pages

✨ AI Summary

Guotai Haitong Securities Co., Ltd. has been appointed as the sponsor for the initial public offering and main board listing of Shenzhen JLC Technology Group Co., Ltd. The sponsor and its designated representatives, Xu Lei and Li Ning, confirm that the application complies with all relevant laws, regulations, and exchange rules. This document serves as the formal sponsorship letter, ensuring the accuracy and completeness of the issuer's disclosure materials.

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Full Translation

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Guotai Haitong Securities Co., Ltd.

Regarding the Initial Public Offering and Main Board Listing of Shenzhen JLC Technology Group Co., Ltd.

To: Shenzhen Stock Exchange

Guotai Haitong Securities Co., Ltd. (hereinafter referred to as the "Sponsor" or "Guotai Haitong Securities") has been engaged by Shenzhen JLC Technology Group Co., Ltd. (hereinafter referred to as the "Issuer," "Company," or "JLC") to serve as the sponsor for its initial public offering and listing on the Main Board (hereinafter referred to as the "Project"). The Sponsor has appointed Xu Lei and Li Ning as the representatives responsible for sponsoring this Project.

The Sponsor and the representatives assigned to this Project, Xu Lei and Li Ning, hereby commit that the Sponsor and its representatives have acted in accordance with the Company Law of the People's Republic of China, the Securities Law of the People's Republic of China, the Administrative Measures for the Registration of Initial Public Offerings of Shares, the Administrative Measures for the Sponsorship of Securities Issuance and Listing, the Listing Rules of the Shenzhen Stock Exchange, and the Guidelines No. 2 for the Content and Format of Listing Sponsorship Letters of the Shenzhen Stock Exchange. The Sponsor and its representatives have acted with honesty, integrity, and due diligence, strictly following established business rules and industry self-regulatory standards to issue this Listing Sponsorship Letter, and guarantee that the information provided is true, accurate, and complete.

Unless otherwise specified, terms used in this Listing Sponsorship Letter have the same meanings as those in the Prospectus for the Initial Public Offering and Main Board Listing of Shenzhen JLC Technology Group Co., Ltd. Any discrepancies between the totals and the sums of the individual components in this document, or between ratios and their calculated values, are due to rounding.

Section 1 Issuer Basic Information

1. Issuer Basic Information

ItemContent
Company NameShenzhen JLC Technology Group Co., Ltd.
English NameShenzhen JLC Technology Group Co., Ltd.
Registered Capital500 million RMB
Legal RepresentativeYuan Jiangtao
Date of IncorporationNovember 15, 2006
Address27th Floor, Olympic Building, No. 2 Shangbao Road, Jinghua Community, Lianhua Street, Futian District, Shenzhen
Postal Code518000
Contact Phone0755-83456516
Websitewww.jlc.com
Emailsecurities@sz-jlc.com
Department Responsible for Information Disclosure and Investor RelationsBoard Office
Person Responsible for Information Disclosure and Investor RelationsPeng Jiahui
Investor Relations Contact Phone0755-83456516

2. Issuer's Main Business

The Company is a leading and industry-transforming comprehensive service provider for electronic industry infrastructure. With the mission of "assisting global hardware innovation," the Company empowers R&D innovation through industrial software, flexible manufacturing through digital technology, and product circulation through industrial internet. Focusing on product R&D and hardware innovation scenarios, the Company meets the "fast delivery, high quality, customized, and one-stop" needs of millions of global customers during sample trial production and small-batch production. Leveraging strong independent R&D capabilities and self-built ordering websites and production/warehousing bases, the Company provides integrated services across the entire industry chain, including EDA/CAM industrial software, printed circuit board (PCB) manufacturing, electronic component procurement, and electronic assembly, with an annual delivery volume exceeding 20 million orders.

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