Announcement on the completion of the redemption of the first phase of short-term financing bonds (science and technology innovation bonds) in 2025

Stock code: 000988 Stock abbreviation: Huagong Technology Announcement number: 2026-15 Huagong Technology Industry Co., Ltd Announcement on the completion of the redemption of the first phase of short-term financing bonds (science and technology innovation bonds) in 2025 The company and all members of the board of directors guarantee that the content of the information disclosure is true, accurate and complete There are no false records, misleading statements or material omissions. Huagong Technology Industry Co., Ltd. (hereinafter referred to as "Huagong Technology" or the "Company") in 2025 On August 20, 2025, the first phase of short-term financing bonds (science and technology innovation bonds) was issued (bond abbreviation: 25 yuan ICT CP001 (Science and Technology Innovation Bond), bond code: 042580430), with a total issuance of RMB 500 million, The term is 210 days, the coupon rate is 1.65%, and the redemption date is March 19, 2026. The specific announcement is detailed See the "2025 First Short-term Financing Bonds (Section) disclosed by the company in designated media on August 23, 2025 Announcement on the issuance of bonds" (Announcement No.: 2025-48). On March 19, 2026, the company paid the first tranche of short-term financing bonds (science and technology innovation bonds) in 2025 Interest totaled RMB504,746,575.34. The above money is paid by the Interbank Market Clearing House Co., Ltd The payment will be made to the bank account designated by the bondholder on the redemption date. This is hereby announced Board of Directors of Huagong Technology Industry Co., Ltd March 31, 2026