301626Suzhou TianmaiSZSE

Suzhou Tianmai Thermal Technology Co., Ltd.

苏州天脉

301626

Shenzhen Stock Exchange

BoardChiNext of Shenzhen Stock Exchange
IndustryComputers, Communication Equipment, and Other Electronic Equipment Manufacturing
ListedOctober 24, 2024
Websitewww.sz-tianmai.com
IR Emailzq@sz-tianmai.com
Phone(+86)0512-66028722
AddressNo. 68, Huikai Road, Luzhi Town, Wuzhong District, Suzhou, Jiangsu

Company Profile

Since its establishment, the company has consistently focused on the research, development, production, and sales of thermal management materials and devices. Through years of technological breakthroughs and research experiments, the company has mastered multiple core technologies, including powder compounding technology, powder surface modification processes, and flat-head heat pipe processing technology. It has continuously improved material formulations, product designs, and technical processes, accumulating strong technological advantages in the field of thermal conduction and dissipation. As one of the few enterprises in the industry capable of mass-producing mid-to-high-end thermal interface materials, heat pipes, and vapor chambers, the company has developed a comprehensive range of thermal interface products. These include five major categories—thermal interface materials, thermal diffusion materials, thermal radiation materials, phase-change heat storage materials, and adhesive sealing materials—encompassing 19 sub-categories such as thermal gels, thermal pads, phase change materials, thermal grease, liquid metal, and graphite sheets. The thermal conductivity of the company's thermal interface materials can reach up to 15 W/m·K, with key performance indicators comparable to those of international competitors. In the field of heat pipes and vapor chambers, the company is an early innovator in the development of ultra-thin heat pipes and vapor chambers. Leveraging its technical expertise and first-mover advantage, it quickly passed certification tests for multiple renowned domestic and international end customers, achieving mass production and delivery of related products. Currently, the company can mass-produce heat pipes and vapor chambers with minimum thicknesses of 0.3mm and 0.22mm, respectively, each with a heat transfer capacity exceeding 5W. The internal core capillary structures are entirely self-produced, and the process technology is at a high level within the industry. With over a decade of extensive experience in thermal conduction and dissipation, the company's products are widely used in end products of many well-known brands such as Samsung, OPPO, vivo, Huawei, Honor, Lenovo, ASUS, NIO, CATL, Hikvision, Dahua, XGIMI, Panasonic, Kyocera, Logitech, and Hisense, thanks to their high quality and superior service. The company maintains strong cooperative relationships with these end customers as well as renowned domestic and international consumer electronics supporting manufacturers like BYD, AAC Technologies, Foxconn, Wistron NeWeb, Sercomm, Everwin Precision, Jiebang Technology, and T&W Electronics. The company leads the industry in production automation. It has established an in-house automation team capable of independently researching, designing, manufacturing, and maintaining various non-standard automated equipment, testing devices, molds, and fixtures, as well as developing software systems compatible with the equipment. In recent years, the company has invested significant resources in independently developing automated production lines for heat pipes and vapor chambers, automated testing lines, and other automated equipment. By integrating self-developed data information systems, the company has continuously enhanced its automation and intelligence levels, reduced unit labor costs, and significantly improved production efficiency. This automation advantage ensures strong competitiveness in terms of delivery timeliness and production costs. The company places great emphasis on R&D innovation and technological accumulation. It has built a multidisciplinary R&D engineering team with expertise in polymer materials and engineering, metal materials science, mechanical design and automation, electronic engineering, fluid dynamics, and thermodynamics, laying a solid foundation for new product development and technological innovation. The company possesses strong comprehensive service capabilities. It has established a dedicated thermal application team that collaborates closely with customers during project development stages, providing thermal simulation design, heat dissipation analysis, feasibility studies of thermal solutions, and other support. This enables rapid response to customer needs and significantly improves project development efficiency. Additionally, leveraging internal resources, the company can tailor personalized product solutions based on customers' usage environments and specific application requirements. It is one of the few enterprises in China with comprehensive service capabilities in the field of thermal conduction and dissipation.

Full description

The company has been dedicated to the research and application of thermal conductive and dissipation products since its establishment, striving to become a leading provider of comprehensive thermal management solutions in the industry. Through years of development and accumulation, the company has mastered proprietary core technologies in material formulation, processing techniques, product structure, and automation, enabling it to provide precise thermal conductive products and innovative cooling solutions to clients in the electronics industry. With over a decade of extensive experience in the thermal dissipation field, the company has earned a strong reputation for high-quality products and superior service. Its products are widely used in end products of many renowned brands, including Samsung, OPPO, vivo, Huawei, Honor, Lenovo, NIO, CATL, Hikvision, Dahua, XGIMI, Panasonic, Kyocera, and Logitech. The company also maintains strong partnerships with leading consumer electronics manufacturers such as BYD, AAC Technologies, Foxconn, Wistron NeWeb Corp., Sercomm, Everwin Precision, and Jorjin Technologies. The company’s core business revolves around the R&D, production, and sales of thermal management materials and components. Its main products include heat pipes, vapor chambers (VC), thermal interface materials (TIM), and graphite films, which are widely applied in smartphones, laptops, and other consumer electronics, as well as security surveillance equipment, automotive electronics, and communication devices.

Announcements

0 shown