Foshan Blue Rocket Electronics Co., Ltd.

Company Profile

1.Technical Advantages The Company has established a comprehensive portfolio of semiconductor packaging and testing processes and owns core technologies including metal substrate packaging,power device packaging,semiconductor and IC testing,ultra-thin chip packaging,high-reliability bonding,high-density frame packaging,robotic automation production systems for semiconductor packaging,fully integrated lithium battery protection ICs,and System-in-Package (SIP) technology.The Company provides full-process packaging and testing services covering 4-inch to 12-inch wafers.It has mastered flip-chip technology and uses SIP technology to redesign frames for multi-chip modules,effectively solving technical bottlenecks in die bonding, wire bonding, chip interconnection,encapsulation and other key packaging processes.In addition,the Company has built mass production platforms for DFN, PDFN and QFN packaging series and achieved mature application of frameless packaging technology.Meanwhile,the Company actively conducts R&D on advanced packaging processes for automotive-grade power devices,chip-scale packaging,memory chip packaging and wide-bandgap semiconductor devices,forming a sound advanced process technology reserve to support its business expansion in power devices,automotive electronics,memory chips and other fields. 2.Product Advantages The Company offers a wide range of products in power semiconductors,chip-scale packaging and third-generation semiconductors.Equipped with advanced automated semiconductor production lines,the Company is continuously expanding its product portfolio in power devices,power ICs and other areas.The Company provides packaging products of various models covering SOT,SOP,TO,PDFN,DFN,QFN and other series.With a diversified product structure of more than 100 series,the Company's products enjoy broad application coverage and can fully meet customers'one-stop procurement demands for multi-level products. The Company's IC product portfolio covers LDOs,AC-DC/DC-DC converters,lithium battery protection ICs,charging management ICs and LED driver ICs,featuring wide coverage and high technological content.Leveraging its fully integrated lithium battery protection IC technology,the Company applies high-density frame packaging and multi-chip integration packaging technology to lithium battery protection ICs,reducing on-resistance and product costs.The new structure MOSFETs feature high switching frequency and high power density,adapting to green energy efficiency requirements in various fields.Meanwhile,the Company has developed new high-integration power devices with top-side cooling and low thermal resistance,which have passed reliability verification and are suitable for high-end application scenarios.The Company can meet customers'customized needs based on its own strengths. 3.Equipment Advantages The Company owns more than 3,400 sets of advanced semiconductor packaging,testing and inspection equipment from domestic and international suppliers,including wire bonding equipment from K&S (US),molding machines from TOWA (Japan),as well as testing and sorting equipment from renowned manufacturers such as ASM and Linkage Tech.Its high-end equipment includes the ASM AD8312FC flip-chip bonder, which can be flexibly connected with reflow soldering and curing oven systems to realise production automation.R&D and testing equipment includes precision instruments such as transient thermal resistance testers,power device characteristic test systems and pull/shear force testers. In recent years,the Company has implemented a digital and intelligent strategy.Through multiple supporting systems such as MES,EAP and ERP,the Company has realised equipment interconnection and achieved full-process intelligent linkage from order receipt to product manufacturing.It has built an intelligent warehousing centre with integrated storage and distribution, relying on automated storage and intelligent sorting to reduce labour costs,achieve full-process cost reduction and efficiency improvement,promote the industrialisation of core packaging and testing technologies,and enhance R&D and production efficiency. During the reporting period,the Company completed its fund-raising projects and put its R&D centre into operation.With advanced R&D and testing equipment,the Company has improved R&D conditions and steadily promoted the industrialisation of automotive-grade packaging and the upgrading of high-power device packaging,enhancing product added value through technological upgrading.Meanwhile,the introduction of high-end technical talents has shortened the R&D cycle,providing support for the improvement of R&D and technological innovation capabilities. 4.R&D Strengths The Company boasts strong R&D capabilities and abundant technical reserves.As of December 31,2025,the Company had 201 R&D personnel. Its core technical personnel each have more than 20 years of experience in the semiconductor industry, forming an outstanding R&D team led by senior engineers,supported by engineers as the backbone, and supplemented by newly introduced high-end technical professionals. In addition, the Company had obtained 150 patents,including 38 invention patents,102 utility model patents,3 software copyrights and 7 integrated circuit layout design patents. During the reporting period,the Company was granted 2 additional invention patents and 3 additional utility model patents. The Company attaches great importance to cooperative R&D with universities and research institutes.During the reporting period,it conducted in-depth cooperation with well-known domestic universities and research institutes such as Sun Yat-sen University,Xidian University,Foshan University and CEPREI Laboratory.It promotes cooperation between scientific and technological talents and universities/research institutes to carry out industry-university-research projects.Through cooperative research and joint postgraduate training, the Company has enhanced its technological innovation capabilities and enriched its technical reserves. 5.Customer Advantages With a diverse product portfolio,the Company provides customers with one-stop services for semiconductor devices.Through years of development and accumulation,the Company's customers are located across various regions in China,and the Company continues to expand its customer base in different areas.Its products are widely used in household appliances,power supplies,electro-acoustics and other fields. Over the years,the Company has established long-term and stable cooperative relationships with its customers. Driven by the continuous development of 5G communication networks, new energy and other markets,the Company leverages its technical expertise accumulated through years of deep engagement in the semiconductor industry to seize industry opportunities.Some of its products have been directly or indirectly applied in emerging sectors such as 5G base stations,security electronics,rail transit, automotive electronics and photovoltaics,providing customers with integrated circuit products including power management ICs and TVS diodes. 6.Comprehensive Management Systems and Qualification Advantages The Company continuously expands the breadth and depth of quality control and has established a sound quality management system.At present,the Company has obtained certifications including ISO 9001 Quality Management System,ISO 14001 Environmental Management System, IATF 16949 Automotive Quality Management System,GB/T 29490 Intellectual Property Management System,ISO 45001 Occupational Health and Safety Management System,ESD S20.20 Electrostatic Discharge Protection System and QC 080000 Hazardous Substance Process Management System.