Maxscend Microelectronics Company Limited

Company Profile

After years of business practice and continuous research and development of new products, the Company’s RF front-end products are becoming increasingly rich and constantly expanding the range of their applications. Their types are gradually enriched from discrete devices to RF modules. The applications have expanded from smart phones to communication base stations, automotive electronics, and Bluetooth headsets. The process ranges from a single mature process to the research and development of advanced processes, as well as the combination of multiple materials and processes. The business model develops from the design, research, and development of the supply chain to the participation in the whole industry chain of design and development, wafer manufacturing, and package testing. Since its establishment and listing, the Company has always been driven by innovation, and has made the following achievements over the past decade: The Company is one of the first enterprises in the industry to achieve the commercialization of RF low-noise amplifiers based on RF CMOS technology; The Company has invented a method of integrating RF switches, greatly shortening their supply cycle and improving the stocking capacity. The Company has applied for a patent on such invention; The Company is one of the first enterprises in the world to produce high-performance antenna tuning switch chips with 12-inch 65nm RF SOI wafers. With excellent performance, the Company’s antenna switches and high-performance low-noise amplifiers are comparable to the international leading technology level; The Company has achieved strong competitive advantages in the fields of RF switches and RF low-noise amplifiers, and has initially developed an ability to compete with international first-class enterprises; The Company is one of the leading enterprises in China to launch 5G sub-6GHz RF front-end chips and module products; The LFEM (integrated RF low-noise amplifier, switch, and filter), a receiving-end module introduced by the Company with differentiated IPD filter scheme, is comparable to international advanced level, and has been widely concerned and highly recognized; As of March 31, 2020, the Company has shipped over 10 billion RF front-end chips; In recent years, the Company has focused on building the industrialization capability of Xinzhuo Semiconductor, successfully establishing an internationally advanced 6-inch SAW filter wafer production line, which has delivered over 100,000 pieces since stabilized large-scale mass production. At the same time, the Company is focused on building a distinctive process platform for radio frequency front-end chips, with the aim of establishing a 12-inch wafer production line. Currently, the 12-inch IPD platform has officially entered the phase of mass production, with all related module products such as L-PAMiF and LFEM fully utilizing self-produced IPD filters. The first-generation process production line for the company's 12-inch radio frequency switches and low-noise amplifiers has successfully transitioned into the phase of mass production. Simultaneously, the Company has initiated the development of the second-generation process, which is currently progressing smoothly. By the end of 2024, the Company has achieved stability and gradual capacity enhancement for key processes of the 12-inch wafer production line, currently reaching a production capacity of 5,000 wafers per month.