Shenzhen Liande Automatic Equipment Co., Ltd.
联得装备
300545
Shenzhen Stock Exchange
Company Profile
Liande Equipment company is a national high-tech enterprise and a national specialized, refined, unique, and innovative 'little giant' company, dedicated to sustainable development through independent innovation. In the realm of technological innovation, Liande Equipment remains at the forefront of the industry, mastering core technologies such as high-vacuum curved surface bonding, material mechanics simulation, machine vision underlying/multi-axis control development, laser cutting/welding, high-speed/high-precision die bonding, flexible assembly, pulse/constant temperature hot pressing, and high-precision machining. These technologies, along with process design capabilities validated through multiple projects, significantly enhance the company's technical leadership in this field, forming the core competitiveness of its products. This has won the favor of customers in new display and semiconductor fields such as semiconductor displays, automotive intelligent cockpit displays, Mini LED displays, VR/AR/MR displays. Liande Equipment closely follows the trends in semiconductor display technology, consolidating its leading position in module equipment while continuously developing new technologies, moving towards mid/front-end processes and high-precision equipment. Liande Equipment will continue to uphold the concept of' innovation-driven development,' deepen technical accumulation, expand application scenarios, and meet the diverse needs of global intelligent manufacturing customers. Liande Equipment is accelerating its internationalization process, aiming to become a world-class leader in industrial automation equipment manufacturing.
Full description
Liande Equipment adheres to a market- and customer-oriented approach, with the vision of “becoming a world-class leading enterprise in the manufacturing of industrial automation equipment through innovative technology” and the mission of “creating value for customers, building a strong brand, and empowering employees.” The company is committed to providing customers with professional, high-performance equipment and solutions. The company specializes in the research, development, production, sales, and service of new semiconductor display intelligent equipment, automotive intelligent cockpit system equipment, semiconductor packaging and testing equipment, and new energy equipment. Its main products include bonding equipment, lamination equipment, polarizer lamination equipment, film covering equipment, inspection equipment, large and ultra-large size TV module line equipment, mobile terminal automation equipment, automotive intelligent cockpit system assembly equipment, Ultra-precision dispensing and 3D dispensing equipment, Mini/Micro LED chip sorting equipment, wafer expanding equipment, vacuum film covering equipment, mass transfer equipment, high-precision splicing equipment, semiconductor flip-chip equipment, die bonder equipment, AOI inspection equipment, lead frame film covering equipment, Perovskite photovoltaic coating/VCD/HP and other equipment, lithium battery die-cutting and stacking foils equipment, cell assembly line and package automation equipment. The company's semiconductor display automation module equipment is widely used in the assembly of display modules in panel displays, particularly for TFT-LCD, OLED, Mini LED, and Micro LED , Silicon based display modules and AR/VR optical waveguide and other related components. The panel displays and related components produced using this module assembly equipment are used in emerging consumer electronics and other terminal products that require display functions, such as VR/AR/MR, smart wearable devices, smartphones, mobile computers, flat panel TVs, LCDs, and automotive electronics. The company's module assembly equipment has successfully entered the automotive electronics market, becoming a global supplier of Tier1 automotive electronics such as Continental Automotive Electronics, Bosch and Visteon , laying a solid foundation for the company's future development. In the semiconductor equipment sector, the company focuses on the research and development, manufacturing, and sales of packaging and testing equipment for the back-end processes of semiconductors. It has successfully developed equipment for high precision display chip flip bonding machine, high speed eutectic process with solid die, soft soldering, AOI inspection, Mini LED chip sorter, Mini LED film machine, lead frame film application, and its inspection. Thanks to R&D foundation, process expertise, and talent in semiconductor die bonding machines, the company has mastered technologies for eutectic, soft soldering, flip-chip die bonding, and sting crystal. Additionally, it has made strategic investments in specialized equipment for lead frame production and inspection, delivering lead frame film applicators and AOI inspection machines in bulk. The company is also actively researching and expanding into advanced wafer-level packaging processes and third-generation semiconductor-related equipment. The company is deepening its strategic layout in the field of intelligent manufacturing equipment, building multiple business areas. While maintaining steady growth in its existing equipment business, the company is actively creating and seizing development opportunities in the new energy equipment sector. Moving forward, the company will accelerate R&D and market expansion in the lithium battery equipment and perovskite equipment sectors, forming a competitive product advantage and achieving new profit growth points for the company.