300456SMEISZSE

Sai MicroElectronics Inc.

赛微电子

300456

Shenzhen Stock Exchange

IndustryElectrical, Electronic and Communication Equipment
ListedMay 14, 2015
Websitewww.smeiic.com
IR Emailir@smeiic.com
Phone(+86)010-82252103
AddressRoom 2607, North Ring Center, No.18, Rd. Yumin, Xicheng District, Beijing; Building 1, Yard 21, Kechuangbajie Street, BDA, Beijing

Company Profile

1、Independent Innovation and R&D Advantages The company’s R&D team has conducted in-depth and systematic research on key technologies related to pure-play MEMS foundry business and IC design services business. It has independently developed and mastered core process technologies as well as core hardware and software design technologies for related products. 2、High-End Talent Advantages The company’s core technical and business teams are comprised of numerous senior professionals with many years of service and extensive experience. Its Chief Scientist, CEOs and CTOs of key subsidiaries, and managers of core product groups all have more than 10 years of industry experience. 3、Multi-Category Expansion Advantages Under the Pure-Play Foundry/Service Model The Company’s pure-play MEMS foundry and IC design services serve primarily chip design companies—a precise business positioning that targets the design link of the industrial chain. This ensures the purity and stability of cooperative relations and provides unique competitive advantages in potential customer expansion and extension of pure-play foundry and service categories. 4、Advanced Process Development and Wafer Manufacturing Technology Advantages The company has accumulated experience in developing more than 500 MEMS processes for its MEMS foundry portfolio (including domestic and overseas production lines). Through long-term manufacturing practices, it has integrated a large number of patented technologies (IP) and technical know-how, boasting a comprehensive process technology reserve covering the MEMS field. Key technologies are mature and have been verified through years of production. 5、Systematic IC Design Service Capability Advantages Qingdao Zhancheng Technology Co., Ltd., a consolidated subsidiary of the company, has delivered more than 5,000 IC design service projects for well-known industry enterprises . As one of the early entrants in this niche field,, it holds a leading position in China’s IC design service sector with industry-leading advantages in systematic IC design service capabilities. 6、Sound Operation Management System and Project Control System Advantages In MEMS, the company has developed an effective operation and management system for MEMS foundries through long-term practice. In IC design services, it has organically combined standardized service processes with customized design optimization. 7、 Gradually Established Integrated Comprehensive Service Advantages The company is actively expanding downstream in the MEMS industrial chain and has initially built advanced MEMS packaging and testing capabilities. It provides advanced integrated packaging and testing services for MEMS devices such as silicon microphones, pressure sensors, inertial sensors, optical devices, RF devices, and biomedical devices. Against the backdrop of growing market demand, the company is leveraging the high relevance and closeness among its businesses to gradually build an integrated service capability covering IC design services and EDA tools, process development, wafer manufacturing, and packaging & testing. 8、High-Quality Customer Resource Advantages The company’s MEMS products cover communications and computing, biomedicine, industrial and automotive, consumer electronics, and other fields. During its operating history, it has served manufacturers in silicon photonics, LiDAR, motion capture, lithography machines, DNA/RNA sequencing, high-frequency communications, AI computing, ICT, infrared thermal imaging, computer networks and systems, social networks, and new medical equipment, as well as leading enterprises in various sub-sectors of communications and computing, biomedicine, industrial and automotive, and consumer electronics. Qingdao Zhancheng Technology Co., Ltd., a consolidated subsidiary, has provided IC design services to more than 300 well-known industry enterprises including Huawei HiSilicon, TSMC, HiGrain Semiconductor, and SMIC. 9、Global Layout and Operation Capability Advantages The company’s pure-play MEMS foundry business has a solid foundation, with advanced pure-play MEMS foundry processes and expanding foundry capacity. In IC design services, the company has actively set up overseas operation branches, enhancing its global layout and operation capabilities. 10、Advantages of the “Dual Circulation” System for Domestic and Overseas Businesses Outside China, Silex Sweden, relying on its mature pilot line, is actively expanding production lines and promoting the gradual ramp-up of capacity after local upgrades and renovations. It has also acquired the semiconductor industrial park where its production line is located, strengthening its capacity guarantee for MEMS process development and wafer manufacturing. After being deconsolidated in July 2025, Silex Sweden is expected to remain a collaborative pillar for the company to promote the overall development of its MEMS business. Within China, relying on the fully built and continuously expanding MEMS mass production line in Beijing Economic-Technological Development Area, the company plans to build an independent MEMS pilot line in China to meet current and future demand. By providing process development and small-batch foundry services, it will reserve and introduce corresponding customers and products for domestic and overseas MEMS mass production lines, ultimately improving process development and mass production capacity both domestically and internationally.

Full description

The Company is a specialized semiconductor service provider with the pure MEMS foundry model as its core philosophy, its competitiveness anchored in specialty processes and manufacturing capabilities, and a focus on international operations. Through long-term accumulation, the Company has mastered core MEMS manufacturing process technologies and is actively expanding its technological layout to encompass specialty processes such as silicon photonics, radio frequency (RF), and analog technologies.In parallel, the Company provides customers with integrated solutions, including IC design services, EDA tool services, specialty process development and integration for MEMS and other devices, as well as wafer manufacturing, packaging and testing services.During the Reporting Period, the Company’s clientele included leading manufacturers in silicon photonics, LiDAR, motion capture, lithography machines, DNA/RNA sequencing, high-frequency communications, AI computing, ICT, infrared thermal imaging, computer networks and systems, social networks, and next-generation medical devices, along with frontrunners in various niche sectors and numerous well-known chip design companies.The chip categories covered by its foundry and service offerings span a wide range of application fields, including communications and computing, biopharmaceuticals and medical devices, industrial and automotive electronics, consumer electronics, and more.The Company has initially established MEMS packaging and testing capabilities and proactively deployed IC design services and EDA tool services. It is committed to providing customers with one-stop comprehensive services, ranging from design services and EDA tools, process development, and wafer manufacturing to packaging and testing.Furthermore, the Company will focus on consolidating a strong presence in the domestic market while expanding its international operations.

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