Yangzhou Yangjie Electronic Technology Co., Ltd.
扬杰科技
300373
Shenzhen Stock Exchange
Company Profile
1. R&D Technology (1) Advanced R&D Technology Platform The Company integrates R&D teams across business divisions through collaboration with industry-leading universities and research institutes, forming a structured R&D system. The headquarters’ Central Research Institute oversees frontier technology, foundational research, and laboratory operations, while business divisions/product lines handle customer-driven product development and mass production, adhering to a "develop-store-research" product management system. A comprehensive simulation platform covering chip, packaging, and applications, alongside a product parameter testing center and new energy/automotive electronics application platforms, supports full-cycle R&D from wafer design to third-generation semiconductors (silicon-based to SiC), and pre-sales to after-sales services. The R&D center laboratory, built to domestic first-class standards (10,000㎡), includes reliability, failure analysis, simulation, and comprehensive R&D labs, certified by CNAS. It features a one-stop experimental platform for chip design simulation, environmental testing, and physical/chemical failure analysis, equipped with advanced testing tools for SiC, IGBT, MOSFET, power modules, and other series. This platform, approved as the "Jiangsu Provincial Key Laboratory for Third-Generation Semiconductor Power Chip & Module Integration Technology," provides multi-platform technical support. (2) Sound Technical Talent System & Management Mechanism The Company adopts a dual strategy of external recruitment and internal training. Externally, it recruits global senior experts (including MIIT advanced manufacturing talents, provincial innovation leaders, and State Council-recognized engineers) across high-end chip design, wafer fabrication, and advanced packaging. Internally, it cultivates talent through campus recruitment (985/211 universities), engineer training programs, and major R&D projects, rapidly expanding its high-quality R&D team. R&D management innovations include: IPD Integration: Introducing Integrated Product Development (IPD) to optimize cross-functional collaboration from market demand to product launch, with a performance evaluation system fostering talent competitiveness. PLM Optimization: Streamlining Product Lifecycle Management (PLM) to enhance R&D efficiency, knowledge accumulation, and technical expertise. Project Monitoring: Conducting full-cycle analysis to resolve bottlenecks, improving R&D efficiency and project success rates. (3) Continuously Enriched R&D Patents & Standards As of June 2025, the Company holds 696 intellectual property rights, including 120 domestic invention patents, 485 utility models, 70 integrated circuit layout designs, 8 software copyrights, and 13 design patents. It leads standard formulation in power semiconductors, participating in national standards (e.g., Discrete Semiconductor Devices - Part 1/2) and group standards (e.g., Conductive Adhesives for Semiconductors, Modular Diode for PV Junction Box). 2. Marketing (1) "Strong Brands" + "Dual Circulation" for Global Reach The Company employs a differentiated brand strategy: MCC Brand: Targets international markets (Europe/US), competing with global leaders like ONSEMI and Infineon, with localized sales/technical centers to enhance market share. YJ Brand: Dominates China/Asia-Pacific markets through strategic partnerships with industry TOP clients. Responding to the "dual circulation" policy, it established a Vietnam subsidiary (Micro (Vietnam) Co., Ltd.) to strengthen overseas supply capabilities. Leveraging a global supply chain, it ensures on-time, high-quality delivery, building a strong international brand image. (2) Key Account Marketing Implementation Focusing on high-quality customers, the Company upgrades its CRM system with LTC (Lead to Cash) processes to standardize sales and improve conversion rates. It deepens partnerships with industry leaders, expands existing customer collaboration, and secures import substitution opportunities with major terminal clients, broadening market potential. A collaborative system (product managers + FAEs + relationship managers) and dedicated industry managers ensure tailored solutions. (3) New Market Focus & Capability Building The Company prioritizes growth in AI, new energy vehicles, and clean energy, targeting TOP clients in automotive electronics, AI servers, robotics, and energy storage. Leveraging IDM and one-stop solutions, it achieved significant revenue growth in automotive and AI sectors during the reporting period, securing certifications and orders from global leaders. 3. Operations Management (1) Upgraded Quality Management System Using VDA6.3 for process evaluation, the Company earned VDA6.3 A-level certification from automotive clients. It implements a "strict input/output control" and "3S1K" (digitalization, intelligent production, professional staff, stable key positions) quality system, aligned with automotive standards (DPPB/DPPM metrics), gaining recognition from international customers. (2) Cost Management Advancements Multi-dimensional cost reduction strategies include R&D innovation, lean production, value stream optimization, and digitalization, reducing failure costs and improving delivery stability. Integrated supply chain (IBP) integration streamlines demand, capacity, and material planning, enabling balanced production and rapid delivery. (3) Lean, Intelligent, & Digital Transformation The Company builds a lean operating system (YBS) through policy deployment (PD), problem-solving, and daily management (DM), using process tools and talent development. Combining lean operations with smart/digital technologies, it aims to create a flexible, efficient factory with minimal lead times, stable quality, and optimal costs.
Full description
1. Industry Development Power semiconductor components, core to power electronics, are widely used in automotive electronics, AI servers, robotics, 5G communications, clean energy, and other fields. Driven by the "dual carbon" strategy and AI trends, demand for energy efficiency and智能化 equipment is rising, boosting the power semiconductor market. In H1 2025, the sector showed "expanding demand and accelerated localization": AI, new energy, and automotive electronics spurred high-performance computing and communication needs, while trade-in policies revived consumer and industrial demand. The competitive landscape remains fragmented, but domestic firms are breaking through chip design and process technologies, improving product quality and brand recognition, reducing reliance on imports. Global leaders, seeking cost reductions, are incorporating Chinese suppliers, creating opportunities for overseas market share growth. 2. Industry Position The Company is a vertically integrated domestic leader in power semiconductors, covering silicon wafer manufacturing, chip design, device packaging, and terminal services. It adopts IDM + Fabless models in high-end fields like MOSFET, IGBT, and third-gen semiconductors. Globally leading in rectifier bridges and PV diodes, it ranks among China’s top 3 power semiconductor enterprises (CSIA), 8th in OMDIA’s global discrete list, and top 20 in multiple international rankings. Certified by global Tier 1 clients, its technologies and products are recognized by mainstream customers. 3. Main Business The Company integrates R&D, production, and sales, focusing on mid-to-high-end power semiconductor products: materials (silicon rods, wafers, epitaxial wafers), wafers (5/6/8-inch silicon, 6-inch SiC chips), and packaged devices (MOSFET, IGBT, SiC, rectifiers, protection devices). Products serve automotive electronics, AI, clean energy, and other sectors, providing one-stop solutions. In H1 2025, it expanded MOSFET, IGBT, and SiC sales in automotive, AI, and industrial markets, driving a 20.58% YoY revenue growth. The Company is internationalizing with 5 global R&D centers, 7 wafer plants, and 3 packaging bases. Its first overseas packaging plant (MCC Vietnam) reached full capacity in Phase I and launched Phase II. The first SiC chip line achieved mass production (domestic leading quality), and the first SiC automotive-grade module packaging project was completed. 4. Business Model Supply Chain: Dual-driven by "strategic collaboration + digital transformation," it established a supplier grading system, enhanced core material stability via capacity interlocking, and optimized supplier performance metrics. To mitigate geopolitical risks, it built an "overseas multi-hub supply network" and completed key material reserves. Procurement adopted a "centralized pool + flexible window" model, reducing costs through scale advantages and shortening custom material lead times. Operations: Centered on a "Zero-Defect Quality System" and "Yangjie Business System (YBS)," it optimized seven management processes, upgraded quality reviews, and achieved industry-leading defect rate reductions. Cost management combined R&D, lean production, and digital tools to cut failure costs and stabilize quality. Lean, intelligent, and digital transformations enabled automated process parameters, integrated production data, and visualized performance metrics (PQDCS). Marketing: Uses "strong brands" (MCC for Europe/America, YJ for China/Asia-Pacific) with localized sales/technical centers. It expanded direct channels (24 countries), formed strategic partnerships with industry leaders, and aligned with "dual circulation" policies to strengthen global influence.