Baoding Technology Co., Ltd.

Baoding Technology Co., Ltd. is a manufacturing company listed on the Main Board of the Shenzhen Stock Exchange since 2011. The company operates through its subsidiary, Jinbao Electronics, which specializes in the design, research and development, production, and sales of electronic copper foil and copper-clad laminates. These materials are essential in modern electronics and find applications across various sectors, including 5G communications, tablets, smartphones, automotive electronics, wearable technology, medical electronics, the Internet of Things, and aerospace and military industries. Jinbao Electronics has established a strong technical and industry presence in the electronic copper foil and copper-clad laminate market. It is recognized as a high-tech enterprise and plays a significant role in the printed circuit board (PCB) supply chain in China. The company has developed a comprehensive product range to meet diverse customer needs and has built long-term, stable relationships with numerous well-known clients. Additionally, Jinbao Electronics has contributed to the formulation of several national standards in the electronic materials sector and has been involved in various research and technology innovation projects.

金宝电子在电子铜箔和覆铜板领域耕耘多年，目前已形成较强的技术竞争力和行业影响力。金宝电子是中国电子材料行业协会常务理事单位、电子铜箔分会副理事长单位、覆铜板分会副理事长单位、中国电子电路行业协会副理事长单位，主持起草了国家标准GB/T4723《印制电路用覆铜箔酚醛纸层压板》，参与起草了国家标准GB/T5230《印制板用电解铜箔》、国家标准GB/T29847《印制板用铜箔试验方法》、国家标准GB/T4722《印制电路用刚性覆铜箔层压板试验方法》和国家标准GB/T31471《印制电路用金属箔通用规范》等多项国家标准。 金宝电子曾先后被认定为“山东省企业技术中心”、“山东省电解铜箔和覆铜板工程技术研究中心”和“山东省电解铜箔制备技术工程试验室”，承担并完成了“高温高延展性超薄电解铜箔”、“挠性覆铜板用铜箔”、“高密度互联印制电路用反转铜箔”等多项国家、省级科研攻关及技术创新项目。2021年12月，金宝电子参与的“高强级薄铜箔制造成套技术及关键装备”项目入选科技部国家重点研发计划“高性能制造技术与重大装备”重点专项2021年度项目（项目编号2021YFB3400800）。 经过多年的技术积累，金宝电子已经形成“电子铜箔+覆铜板”主营业务结构，具备较强的核心竞争力。