Tianshui Huatian Technology Co., Ltd.
华天科技
002185
Shenzhen Stock Exchange
Company Profile
Technical competence: The Company enhanced R & D investment by perfecting the R & D simulation platform and participating National Science and Technology 02 Major Project and other technological innovations and continuously research and development of new products, new technology, and new process. The company has developed FlipChip, Bumping, MEMS, MCM (MCP), WLP, SiP, TSV, Fan-Out and other advanced packaging technology and products independently. Sales Network: The Company has a solid customer base and a wide-spreaded sales network, has made presence globally, thus providing a strong market guarantee for the company's further growing. Scalable efficiency: The Company keeps high CapEx on the capacity and technical capability ramp-up. At the same time, it has maintained a sustainable and healthy development through continuous technical and management innovation. Management team: The Company has a strong management team with experienced operating skills, innovative vision, high unity and upward spirit. The company has formed a set of advanced large-scale production management system through years of production practices.
Full description
The IC industry, which the company belongs to, with its complicated technology and highly specialized industrial structural dependency, segmented into three phases,IC Design, Chip Manufacturing, IC Assembly and Test according to the processing flow. IC industry design oriented, it determined the chip function and application field. Once the Design Houses completed its design scheme, they entrusts to the Foundry to do the chips manufacturing in a wafer form, and then place orders to 3rd-party OSAT(Outsourced Semiconductor Assembly and Test) company like us to finish the assembly and test, then sell the product to downstream enterprise who are making the final electronic devices. There is another type of business model in IC industry like Samsung and Intel who complete the whole process by their own facility so called IDM (Integrated Devices Manufacturer). The company is the Top 10 IC Assembly and Test Company world-wide. Its main business model is to provide professional IC assembly and test services according industry technical standards and specifications to fulfill customers special requirements. The company has always adhered to our Quality Policy of "Our job is to make the customer satisfied" and Business Philosophy of "Customer First, Quality First". After long-term unremitting efforts, the company has established solid relationship with more than 800 domestic and oversea customers. Currently, the company has established manufacturing facilities in Tianshui, Xi'an, Kunshan, Shanghai, Nanjing，Chengdu in mainland China and Ipoh，Malaysia. The pofortlio of IC Assembly includes DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/QFN/DFN, BGA/LGA, FlipChip, MCM (MCP), SiP, WLP, TSV, Bumping, MEMS and etc. Major application fields are Computer, Network Communications, Consumer electronics and smart mobile terminals, Internet of Things, Industrial, Automotive，HPC and etc. As a high-tech enterprise, the Company has accumulated a large number of IC assembly and test technologies with independent intellectual property rights and has taken a leading position in the domestic industry in technical strength, production scale and economic benefits, through continuous technological innovation. The company undertook the R & D tasks of a number of major science and technology projects (topics) of "VLSI（Very Large Scale Integrated Circuit）Manufacturing Technology and integrated Process " and awarded the honorary title of "Trusted Brand in Chinese Semiconductor Market", "Most Influential Enterprise in Chinese Semiconductor Market" And "China's Top Ten Semiconductor Assembly and Test Companies," and other honorary title , and vary products and technologies were named "China's Semiconductor Innovation Products and Technologies.